Pixel Circuit and Emission Layout for Dense LED Display Panels

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Solution Overview

Problem

Current display devices face challenges in efficiently arranging light emitting diodes (LEDs) to enhance light output while minimizing the number of masks required in the manufacturing process, which complicates the fabrication process and increases complexity.

Innovation Solution

A display device design where light emitting elements are intensively disposed in a target area with a multi-layer structure, including conductive and insulating layers, allowing the pixel circuit and display element parts to be formed on the same surface, reducing the thickness and simplifying the fabrication process by using a shared process for both parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If light emitting elements are densely arranged to enhance light output efficiency, then light output efficiency is improved, but device complexity increases due to more layers and components

Engineering Contradiction:
Improvelight output efficiencyVSAvoiddevice complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent combines the pixel circuit part and display element part into a single integrated structure on the same substrate surface. The pixel circuit part includes transistors and capacitors for controlling multiple light emitting elements, while the display element part includes the light emitting elements themselves. By merging these previously separate components into one integrated pixel structure, the patent achieves dense arrangement of light emitting elements for enhanced light output efficiency while managing device complexity through unified design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a multi-layer structure with conductive layers and insulating layers arranged in different dimensions. The pixel circuit part and display element part are disposed in the same layer, while other components are arranged in different layers above and below. This three-dimensional arrangement allows dense packing of light emitting elements in the horizontal plane while vertically stacking functional layers to manage complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If multiple masks are used to fabricate different parts separately, then manufacturing precision is improved, but the number of fabrication processes increases

Engineering Contradiction:
Improvemanufacturing precisionVSAvoidfabrication process efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent combines the fabrication processes for the pixel circuit part and display element part into a single integrated process. Both parts are formed simultaneously on the same substrate using the same sequence of steps: forming insulating layers, forming conductive layers with patterns, forming semiconductor layers, and forming light emitting elements. This unified approach reduces the number of separate fabrication processes while maintaining manufacturing precision through consistent process control.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If pixel circuit part and display element part are formed in separate layers, then ease of manufacture is improved, but device thickness increases

Engineering Contradiction:
Improveease of manufactureVSAvoiddevice thickness
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent transitions from a vertical stacking approach to a planar integration approach by disposing both the pixel circuit part and display element part in the same layer on the substrate surface. This two-dimensional arrangement reduces the vertical thickness of the device while maintaining ease of manufacture through standardized thin-film deposition and patterning processes. The multi-layer structure provides necessary electrical isolation and connectivity without significantly increasing overall device thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11990579B2Display device and method of fabricating the same
Publication Date: 2024.05.21 SAMSUNG DISPLAY CO LTD
  • US11990579B2 patent drawing
  • US11990579B2 patent drawing
  • US11990579B2 patent drawing

AI summary

A display device includes a substrate and pixels. The substrate includes: a display area including pixel areas, each including a first area and a second area; and a non-display area enclosing at least one side of the display area. The pixels are disposed on the pixel areas, each pixel including light emitting elements. Each pixel further includes: a pixel circuit part disposed on the first area and including at least one transistor and at least one capacitor; and a display element part disposed on the second area and including an emission area to emit light. Each of the pixel circuit part and the display element part has a multi-layer structure including one or more conductive layers and one or more insulating layers. At least one layer of the pixel circuit part and at least one layer of the display element part are disposed in a same layer.