Pixel Transfer Gate Light Shielding for Stray Light Leakage

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Solution Overview

Problem

Global shutter CMOS image sensors face issues with parasitic light leakage, which contaminates stored charges and degrades image quality due to exposure to stray or unwanted light, affecting shutter efficiency and device performance.

Innovation Solution

Incorporating light-shielding structures made of suitable materials within the interlayer dielectric layer to protect the transfer gate structure from stray light, with a design that includes an indentation to encircle the transfer gate, effectively shielding it from unwanted light and minimizing contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If light-shielding structures are added to protect transfer gate structure, then shutter efficiency and image quality improve, but device complexity increases

Engineering Contradiction:
Improveshutter efficiencyVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The light-shielding structure is formed by nesting multiple material layers (first light-shielding material layer, second light-shielding material layer) within the interlayer dielectric structure. The transfer gate structure extends into an indentation of the light-shielding structure, creating a nested configuration that provides effective shielding while integrating seamlessly with the existing pixel structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The light-shielding structure is positioned in the vertical dimension within the interlayer dielectric, covering the transfer gate structure from above. This vertical shielding approach adds protection without significantly increasing horizontal footprint, effectively addressing parasitic light leakage from the top direction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If light-shielding structures are added to protect transfer gate structure, then image quality improves, but manufacturing complexity increases

Engineering Contradiction:
Improveimage qualityVSAvoidease of manufacture
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The light-shielding structure is segmented into multiple material layers (first light-shielding material layer and second light-shielding material layer) with different properties. This segmentation allows each layer to be optimized for specific functions (light blocking, structural support, integration with surrounding structures) while simplifying the overall manufacturing process through modular construction.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The light-shielding structure is formed during the manufacturing process by depositing light-shielding material layers and creating indentations before final pixel assembly. This preliminary formation of the shielding structure with integrated indentations ensures proper positioning and protection of the transfer gate structure throughout subsequent manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The light-shielding structures enhance global shutter efficiency and image quality by preventing light leakage, leading to improved performance and reduced unwanted artifacts in image sensors.

Implementation Method 1

a light-shielding structure contained within the ILD and covering the transfer gate structure, the light-shielding structure including an indentation on a first end surface of the light-shielding structure

Methodology Applied
Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS20240313017A1Light shield for pixel of image sensor
Publication Date: 2024.09.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240313017A1 patent drawing
  • US20240313017A1 patent drawing
  • US20240313017A1 patent drawing

AI summary

A pixel of an image sensor includes: a semiconductor material substrate; a photosensitive region formed in the substrate, the photosensitive region generating photo-induced electrical charge in response to illumination with light; a storage node formed in the substrate proximate to the photosensitive region, the storage node selectively receiving and storing photo-induced electrical charge generated by the photosensitive region; a transfer gate structure formed between the photosensitive region and the storage node to regulate a transfer of the photo-induced electrical charge therebetween; an inter-layer dielectric (ILD) formed over the transfer gate structure; and a light-shielding structure contained within the ILD and covering the transfer gate structure so as to inhibit light from reaching the transfer gate structure, the light-shielding structure including an indentation on a first end surface of the light-shielding structure, which first end surface is proximate to the transfer gate structure, wherein an end of the transfer gate structure at least partially extends into the indentation such that the end of the transfer gate structure extending into the indentation is at least partially surrounded by the light-shield structure.