Pixel Transfer Line Sharing for Higher-Sensitivity Image Sensors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing solid-state imaging devices face challenges in increasing the sensitivity characteristics due to limitations in the ratio of light opening area to pixel area, primarily caused by the need for numerous control lines for gate electrodes and charge accumulators.
Innovation Solution
The implementation of a solid-state imaging device configuration that reduces the number of control lines by synchronizing the operations of first transfer electrodes across multiple pixels, allowing for increased light opening area and improved sensitivity characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling structure is integrated into the solid-state imaging device, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent integrates the cooling structure directly into the substrate that supports the pixel array, merging the imaging function with the cooling function into a single integrated component. This eliminates the need for separate cooling devices while maintaining effective heat dissipation from the photodiodes.
Solution Approach 2:
The patent introduces a thermal conductor material as an intermediary between the pixel array and the cooling structure, facilitating efficient heat transfer from the heat-generating photodiodes to the cooling channels without requiring direct contact between sensitive imaging components and the cooling mechanism.
2Measurement precision
If the pixel array density is increased, then imaging resolution is improved, but heat generation increases
Solution Approach 1:
The patent divides the substrate into multiple regions with integrated cooling channels that are distributed throughout the pixel array area, allowing heat from densely packed pixels to be locally dissipated rather than accumulating in concentrated zones, thus supporting high-resolution imaging with effective thermal management.
3Volume of moving object
If the solid-state imaging device is miniaturized, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent nests the cooling channels within the substrate structure itself, placing heat dissipation pathways inside the same component that supports the pixel array. This nested arrangement enables effective heat dissipation in a miniaturized form factor without requiring external cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the sensitivity characteristics of the solid-state imaging device by increasing the light opening area, thereby improving the device's ability to capture images with higher resolution and accuracy.
Implementation Method 1
a cooling channel 13 for circulating a cooling fluid in order to remove heat generated by the pixel array 11
Implementation Method 2
a microlens 12 for incident light to be applied to the photodiode
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A solid-state imaging device (100) includes a plurality of pixels (13) arranged in matrix form, each pixel including a photoelectric converter (1) and a plurality of first transfer electrodes (3), and a plurality of control lines (12) connected to mutually-corresponding ones of the first transfer electrodes (3) in a plurality of pixels (13) arranged in a specific row. The plurality of pixels (13) include a plurality of first pixels (13a) and a plurality of second pixels (13b). Each of the first pixels (13a) includes a floating diffusion layer (4) and a readout circuit (5). Each of the second pixels (13b) shares the floating diffusion layer (4) with one of the first pixels (13a) arranged in a column direction. At least some of the plurality of control lines (12) are further connected to the first transfer electrodes (3) of pixels (13) that are arranged adjacent in the column direction to respective ones of the plurality of pixels (13) arranged in the specific row and that share at least one of the floating diffusion layers (4).