Pixel Separation Structure for Infrared Sensitivity and Crosstalk
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Solution Overview
Problem
Photoelectric conversion devices face challenges in simultaneously improving sensitivity to near-infrared light and suppressing optical crosstalk, as metal-filled Deep Trench Isolation (DTI) reduces sensitivity due to light absorption, while dielectric-filled DTI lacks effective light shielding.
Innovation Solution
A photoelectric conversion device with a semiconductor layer and pixels separated by a pixel separation portion that includes a metal filling portion, such as copper, tungsten, cobalt, or aluminum, and a dielectric film of silicon oxide on the side portion, optimizing the thickness of the dielectric film to achieve high light shielding and low light absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the DTI is filled with a metal material, then optical crosstalk is suppressed and light shielding is improved, but sensitivity to near-infrared light decreases due to light absorption
Solution Approach 1:
The pixel separation portion uses a composite structure combining metal filling material (for light shielding) and dielectric material (for reduced absorption), achieving both optical crosstalk suppression and sensitivity improvement through material composition
2Reliability
If the DTI is filled with a dielectric material, then sensitivity to near-infrared light is improved due to reduced light absorption, but optical crosstalk increases due to inferior light shielding property
Solution Approach 1:
The pixel separation portion uses a composite structure combining metal filling material (for light shielding) and dielectric material (for reduced absorption), achieving both optical crosstalk suppression and sensitivity improvement through material composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the sensitivity to near-infrared light while effectively suppressing optical crosstalk by maximizing reflectance and minimizing transmittance, achieving a balance between light shielding and sensitivity.
Implementation Method 1
Light incident on the photoelectric conversion device is diffracted by the periodic uneven structure portion
Implementation Method 2
The diffracted light is reflected by a pixel separation portion having a trenched structure to be confined to the inside of one pixel
Implementation Method 3
under the influence of light absorption by the metal material, a sensitivity of a photoelectric conversion device to light may decrease
Data Source
AI summary
A photoelectric conversion device includes a semiconductor layer formed of silicon, a plurality of pixels formed in the semiconductor layer, and a pixel separation portion is formed to separate each of the plurality of pixels, wherein the pixel separation portion includes a metal filling portion and a dielectric film provided on a side portion of the metal filling portion, a material of the metal filling portion is copper, a material of the dielectric film is a silicon oxide, and a thickness of the dielectric film is not less than 50 nm and not more than 270 nm.


