Pixel-Source Electrode Connection Structure Against Undercut Corrosion
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Solution Overview
Problem
Some array substrates face issues with effective connection between the pixel electrode and the source electrode, leading to reduced product yield rates due to problems like undercut during etching and oxidation corrosion.
Innovation Solution
The array substrate includes a connection structure that connects the source electrode and the pixel electrode, either through a via hole structure exposing both electrodes or by being disposed between them. This connection structure ensures effective electrical connection and prevents oxidation corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via hole structure is used to connect the pixel electrode and source electrode, then the electrical connection is improved, but the risk of undercut during etching and oxidation corrosion increases
Solution Approach 1:
The patent introduces a connection structure as an intermediary element between the pixel electrode and source electrode. This connection structure includes a connection electrode and connection wiring that mediate the electrical connection, preventing direct exposure of the electrodes to etching and oxidation environments while maintaining reliable electrical connectivity.
Solution Approach 2:
The connection structure is formed in advance before the pixel electrode and source electrode are fully exposed to the etching process. By preliminarily establishing the connection path through the connection electrode and wiring, the structure protects the electrodes from undercut and oxidation corrosion that would occur during subsequent etching and processing steps.
2Object-affected harmful factors
If additional ashing processes are implemented to prevent oxidation corrosion, then the protection against oxidation is improved, but the manufacturing complexity and production costs increase
Solution Approach 1:
The connection structure serves as a protective intermediary that physically separates the pixel electrode and source electrode from the oxidizing environment. This structural protection eliminates the need for additional chemical protection steps like ashing processes, thereby reducing manufacturing complexity while maintaining oxidation resistance.
Solution Approach 2:
The patent replaces chemical protection methods (ashing processes) with a mechanical/structural protection approach. The connection structure provides physical protection against oxidation corrosion through its geometric configuration and material properties, substituting the need for complex chemical treatment processes.
3Ease of manufacture
If the pixel electrode and source electrode are directly connected, then the manufacturing process is simplified, but the product yield rate decreases due to connection failures
Solution Approach 1:
The connection structure acts as a buffered intermediary that simplifies the manufacturing process by providing a dedicated connection path, while simultaneously improving product yield rate. The connection electrode and wiring are specifically designed to ensure reliable electrical connection, reducing connection failures despite the additional structural element.
Data Source
AI summary
The present disclosure provides an array substrate, a method for manufacturing the array substrate, and a display apparatus. The array substrate includes: a base substrate, a thin film transistor disposed on the base substrate; a first passivation layer, an organic film layer and a pixel electrode disposed on the thin film transistor; a connection structure for connecting the source electrode of the thin film transistor and the pixel electrode, wherein the connection structure is disposed in a via hole structure exposing the pixel electrode and the source electrode; or, the connection structure is disposed between the pixel electrode and the source electrode.