Pixel Substrate Insulating Layer Layout Against Dummy Terminal Contamination

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Solution Overview

Problem

In semiconductor devices and solid-state image sensors, dummy terminals that do not contribute to substrate joining can act as metal contamination sources.

Innovation Solution

The semiconductor device incorporates a configuration where a first insulating layer is arranged above a second substrate, and a second insulating layer is positioned at least partially above the first insulating layer, with the second terminal embedded within the second insulating layer, thereby preventing metal contamination from dummy terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If dummy terminals are included on the substrate for non-joining purposes, then the substrate can accommodate future expansion or design flexibility, but metal contamination can occur from these dummy terminals during the joining process

Engineering Contradiction:

Improvedesign flexibilityVSAvoidmetal contamination

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

An insulating layer is introduced as an intermediary between the dummy terminal and the joining interface. This insulating layer prevents direct contact between the metal dummy terminal and other substrates or components during the joining process, thereby eliminating the metal contamination risk while preserving the dummy terminal's presence for design flexibility.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The dummy terminal is covered with an insulating material that effectively neutralizes its potential contamination risk. The insulating layer acts as a sacrificial protective barrier that can be applied universally to any dummy terminal structure, providing a simple and effective solution to the contamination problem.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Productivity

If substrates of different areas are joined together, then device integration and packaging efficiency are improved, but dummy terminals on smaller substrates may cause contamination issues

Engineering Contradiction:

Improvepackaging efficiencyVSAvoidmetal contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The insulating layer serves as a universal intermediary that can be applied to substrates of any size or configuration. It prevents metal contamination from dummy terminals on smaller substrates during the joining process, enabling efficient integration of substrates with different areas without compromising cleanliness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating layer is applied specifically to regions containing dummy terminals or in areas where contamination risk exists, rather than uniformly across the entire substrate. This localized approach maintains packaging efficiency while针对性地 preventing contamination from dummy terminals on smaller substrates.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12218169B2Semiconductor device and solid-state image sensor including pixel substrate joined with another substrate

Publication Date: 2025.02.04 SONY SEMICON SOLUTIONS CORP

AI summary

A semiconductor device includes a first substrate which is individualized and includes a first semiconductor circuit (LOG) including a first terminal, and a second substrate which includes a second semiconductor circuit (PIX) including a second terminal. The first terminal and the second terminal are joined. The second substrate includes a first insulating layer that is arranged above the second substrate, and a second insulating layer that is arranged at least partially above the first insulating layer and in which the second terminal is arranged.