Pixel Trench-Notch Layout for Manufacturable NIR Absorption

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Solution Overview

Problem

Existing pixel designs with trenches for increasing light path in silicon photodetectors face manufacturing challenges and inefficiencies in light absorption, particularly for near-infrared wavelengths, due to optimized trench dimensions that are difficult to produce using standard microelectronic fabrication processes.

Innovation Solution

The design incorporates trenches with notches in a central region, forming a grid-like pattern that mimics the absorption efficiency of previous designs but is manufacturable using standard processes, with trenches and notches aligned in a specific pattern to enhance light absorption without crossing each other, and V-shaped patterns in corners for improved symmetry and light dispersal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optimized trench dimensions are used to improve light absorption efficiency, then quantum efficiency is improved, but manufacturing difficulty increases due to incompatibility with standard microelectronic fabrication processes

Engineering Contradiction:
Improvequantum efficiencyVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent modifies the geometric parameters of the trench structure by adding notches at specific positions and orientations. These parameter changes enable the structure to achieve enhanced light absorption efficiency while remaining compatible with standard microelectronic fabrication processes, thus resolving the contradiction between improved quantum efficiency and manufacturing ease

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The continuous trench structure is segmented by introducing notches that divide the trench into multiple sections. This segmentation increases the effective light path length and improves light absorption efficiency while maintaining manufacturability through standard fabrication techniques

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If standard microelectronic fabrication processes are used to simplify manufacturing, then ease of manufacture is improved, but light absorption efficiency decreases due to inability to achieve optimized trench dimensions

Engineering Contradiction:
Improveease of manufactureVSAvoidlight absorption efficiency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

By changing the geometric parameters of the trench structure through the addition of notches, the patent achieves enhanced light absorption efficiency using standard fabrication processes, thus resolving the contradiction between ease of manufacture and light absorption efficiency

Inventive Principle:
Principle #35Parameter changes

3Reliability

If light path length in silicon is increased to improve absorption of near-infrared light, then quantum efficiency is improved, but device complexity increases due to need for specialized structures

Engineering Contradiction:
Improvequantum efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The trench structure is segmented with notches to increase the effective light path length, improving quantum efficiency while maintaining a relatively simple overall structure that does not require specialized fabrication processes

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The notches are positioned at specific orientations (e.g., 45 degrees) to create a three-dimensional light scattering effect that increases the effective light path length without significantly increasing the physical footprint or structural complexity of the device

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances quantum efficiency by dispersing light and increasing the light path in the photodetector, improving absorption by up to 3.8% compared to similar pixels, while being manufacturable with standard microelectronic processes, thus overcoming previous manufacturing limitations.

Implementation Method 1

This design enhances quantum efficiency by dispersing light and increasing the light path in the photodetector

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 2

it is known to add diffractive structures on a face of the pixel which is intended to receive light

Methodology Applied
Scientific EffectDiffraction: Diffraction

Data Source

PatentUS20250022894A1pixel
Publication Date: 2025.01.16 STMICROELECTRONICS INT NV
  • US20250022894A1 patent drawing
  • US20250022894A1 patent drawing
  • US20250022894A1 patent drawing

AI summary

A pixel includes, on a first face, first trenches extending parallel to a first direction and regularly spaced in a second direction (orthogonal to the first direction) and second trenches extending parallel to the second direction and regularly spaced in the first direction. The first trenches include first notches, each first notch extending from a first trench and being aligned with a corresponding second trench. The second trenches include second notches, each second notch extending from a second trench and being aligned with a corresponding first trench.