Pixel Via Layer Segmentation for Planar Surface
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Solution Overview
Problem
Existing display devices face issues with contact failure of light emitting elements due to non-planar surfaces, leading to reliability concerns in pixel and display device performance.
Innovation Solution
A pixel design featuring a via layer with distinct thickness parts and alignment electrodes at the same level as the via layer's surface, ensuring a planar insulating layer for light emitting elements, which are electrically connected to prevent contact failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via layer with varying thickness is used to accommodate underlying structures, then the electrical connection is improved, but the surface becomes non-planar causing contact failure of light emitting elements
Solution Approach 1:
The via layer is segmented into a first part with first thickness and a second part with second thickness. The first part provides adequate electrical connection to underlying structures, while the second part is positioned at emission areas to maintain surface planarity for light emitting element contact, thus resolving the contradiction between electrical connection reliability and surface planarity.
Solution Approach 2:
Different thickness regions are created within the via layer: the first part has greater thickness for reliable electrical connection in non-emission areas, while the second part has reduced thickness specifically at emission areas to ensure surface planarity. This local differentiation allows each region to optimize its function without compromising the other.
2Reliability
If the via layer thickness is increased to ensure electrical connection, then contact reliability improves, but the surface becomes non-planar affecting light emitting element placement
Solution Approach 1:
The via layer is divided into thickness segments: a first part with greater thickness for electrical connection and a second part with reduced thickness for surface planarity. This segmentation allows the structure to simultaneously achieve both contact reliability and surface planarity by assigning different thickness characteristics to different functional regions.
Solution Approach 2:
The solution addresses the thickness problem by introducing spatial differentiation within the via layer structure. By creating a first part and second part at different positions and thicknesses, the invention transforms a single-dimension problem (uniform thickness) into a multi-dimensional solution (varying thickness in different spatial locations), achieving both electrical connection and surface planarity.
3Manufacturing precision
If alignment electrodes are added to maintain surface level, then surface planarity is improved, but device complexity increases
Solution Approach 1:
The second part of the via layer serves multiple functions: it provides electrical connection pathways and simultaneously maintains surface planarity at emission areas, eliminating the need for separate alignment electrodes. This multi-functionality reduces device complexity while achieving the desired surface planarity for light emitting element placement.
Solution Approach 2:
The invention extracts the surface planarity maintenance function from a separate alignment electrode component and integrates it directly into the via layer structure through the second part. This integration eliminates unnecessary components and simplifies the overall device structure while maintaining the required surface planarity.
Data Source
AI summary
A pixel includes: an emission area and a non-emission area; a via layer including a lower surface and an upper surface, the via layer including a first part having a first thickness, and a second part having a second thickness; a first alignment electrode and a second alignment electrode on the via layer and spaced from each other; an insulating layer on the via layer, the first alignment electrode, and the second alignment electrode, the insulating layer having a planar surface; a first electrode and a second electrode in the emission area and spaced from each other; and light emitting elements on the planer surface of the insulating layer in the emission area, and electrically connected to the first electrode and the second electrode. The first and second alignment electrodes may be on the second part of the via layer and overlap the second part of the via layer.