Pixelated Chuck Conforming to Warped Semiconductor Wafers

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Solution Overview

Problem

Existing semiconductor wafer fixturing mechanisms struggle to securely retain warped wafers, leading to high scrap rates and inefficiencies, as they require a planar surface match and cannot accommodate varying warpage patterns.

Innovation Solution

A pixelated chuck with independently movable sections and actuators that conform to the unique warpage of each semiconductor wafer, using vacuum pressure and electrostatic forces to retain and process warped wafers without mechanical flattening.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a planar surface matching mechanism is used to retain semiconductor wafers, then the retention stability is improved for flat wafers, but the adaptability to warped wafers deteriorates

Engineering Contradiction:

Improveretention stabilityVSAvoidadaptability to warped wafers

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The chuck surface is divided into multiple independently controllable pixel elements (e.g., 64x64 array of 50 micrometer pixels). Each pixel can be individually actuated to adjust its height, allowing the surface to be segmented and reconfigured to match various warpage patterns while maintaining overall retention stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chuck transitions from a static planar surface to a dynamic, adaptive surface. Each pixel element can be independently positioned along the Z-axis based on real-time warpage measurements, enabling the surface to dynamically conform to different wafer geometries and maintain reliable retention.

Inventive Principle:

Principle #15Dynamics

2Reliability

If manual wafer flattening techniques are used, then the retention of warped wafers is improved, but the manufacturing efficiency deteriorates due to high cost and time consumption

Engineering Contradiction:

Improveretention of warped wafersVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces manual mechanical flattening operations with an automated pixelated chuck system. The chuck uses controlled mechanical actuation of pixel elements (via piezoelectric actuators or similar mechanisms) to automatically conform to wafer warpage, eliminating the need for time-consuming manual intervention and significantly improving manufacturing efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system changes the physical parameters of the chuck surface (height, curvature, local topology) based on measured wafer warpage characteristics. By adjusting pixel positions according to warpage data, the system adaptively modifies the retention surface parameters to match each wafer's unique geometry, enabling automated retention without manual flattening.

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If a fixed planar chuck surface is used, then the device complexity is reduced, but the manufacturing precision deteriorates for warped wafers

Engineering Contradiction:

Improvechuck structure simplicityVSAvoidsurface conformance precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The chuck surface is segmented into a grid of pixel elements that can be independently controlled. This segmentation allows the system to achieve high surface conformance precision by adjusting individual pixels to match warpage patterns, while the modular pixel structure keeps the overall device design manageable through repetition of standardized elements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The pixelated chuck design serves multiple functions: it provides a planar surface for flat wafers, conforms to various warpage patterns, and can potentially apply localized forces for warpage correction. This multi-functionality is achieved through a standardized pixel array that can be configured for different retention and processing needs, reducing the requirement for multiple specialized fixtures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces scrap rates and improves manufacturing efficiency by effectively processing warped wafers, minimizing damage and increasing throughput, while reducing reliance on costly manual techniques.

Implementation Method 1

The pixelated chuck may then be actuated to conform to the warpage characteristics of the semiconductor wafer. The pixelated chuck may retain the semiconductor wafer

Methodology Applied

Scientific EffectVacuum pressure: Vacuum

Implementation Method 2

The pixelated chuck may retain the semiconductor wafer using vacuum pressure, electrostatic forces, or a combination of both.

Methodology Applied

Scientific EffectElectrostatic forces: Electrostatics

Data Source

PatentUS12550671B2Pixelated chuck for retaining warped semiconductor wafers

Publication Date: 2026.02.10 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

Described is a semiconductor processing system including a measurement tool configured to measure warpage characteristics in a semiconductor wafer. The semiconductor processing system further includes a pixelated surface configured to retain the semiconductor wafer, where the pixelated surface approximates the warpage characteristics to conform to the semiconductor wafer. The semiconductor processing system further includes a semiconductor processing tool configured to perform processing on the semiconductor wafer while it is retained on the pixelated surface.