Pixelated Light-Absorptive Layer for Polymer Film Delamination
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Solution Overview
Problem
Current methods for delaminating polymer films from carrier plates, such as using thermal release layers or excimer lasers, face limitations including high processing temperatures, high costs, and low throughput.
Innovation Solution
A method involving a pixelated pattern of light-absorptive and light-reflective materials on a carrier plate, where a pulsed light source heats the light-absorptive material to generate gas at the interface, facilitating the release of the polymer film without damaging the electronic structures, with optional surface tension and dynamic release layers for controlled delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal release layers or excimer lasers are used for delamination, then the polymer film can be removed from the carrier plate, but the processing temperature increases and costs increase
Solution Approach 1:
The patent applies local quality by creating a pixelated pattern where different regions of the carrier plate have different optical properties. Light-absorptive material regions are strategically placed to generate localized thermal zones that produce gas for delamination, while light-reflective regions prevent overheating. This spatial differentiation allows delamination to occur at lower overall temperatures compared to conventional thermal release methods that require uniform high-temperature processing across the entire substrate.
Solution Approach 2:
The patent employs periodic action by using pulsed light illumination rather than continuous heating. The pulsed light source delivers intermittent thermal energy to the light-absorptive material, generating gas bubbles at specific intervals that progressively delaminate the polymer film. This periodic energy input achieves effective delamination at lower peak temperatures compared to sustained thermal processing, reducing both processing temperature and energy consumption.
2Reliability
If thermal release layers or excimer lasers are used for delamination, then the polymer film can be removed from the carrier plate, but the cost increases
Solution Approach 1:
The patent implements this principle by replacing expensive excimer laser systems with inexpensive, commercially available light sources such as LED arrays or fluorescent lamps. The light-absorptive and light-reflective material layers deposited on the carrier plate serve as disposable functional elements that enable cost-effective delamination. This substitution dramatically reduces equipment and material costs while maintaining reliable delamination performance.
Solution Approach 2:
The patent replaces the mechanical/optically complex excimer laser system with a simpler illumination system using conventional light sources. Instead of relying on high-energy ultraviolet laser pulses, the invention uses visible or near-UV light from inexpensive sources that interact with the pixelated light-absorptive/reflective pattern to achieve delamination. This substitution simplifies the manufacturing system and reduces both capital equipment costs and operational expenses.
3Reliability
If conventional delamination methods are used, then the polymer film can be released, but the throughput is low
Solution Approach 1:
The patent applies segmentation by dividing the carrier plate surface into a pixelated pattern of light-absorptive and light-reflective regions. This segmentation allows multiple zones to undergo delamination simultaneously through parallel gas bubble generation across different pixel regions. Consequently, the entire polymer film can be delaminated in a single processing step rather than requiring sequential scanning, dramatically increasing throughput while maintaining effective delamination across the full substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces costs and increases throughput by using inexpensive light sources and achieving larger delamination areas, while minimizing damage to the polymer film and electronic structures.
Implementation Method 1
a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer
Implementation Method 2
The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the carrier plate stack and the polymer film
Implementation Method 3
generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate
Data Source
AI summary
A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.