Pixelated UV Semiconductor Component for Direct 3D Resin Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional 3D printing methods are slow and uneconomic for large-scale production due to the sequential construction of 3D objects from powder baths, requiring intermediate optics and imaging units, which limits spatial resolution and efficiency.
Innovation Solution
An optoelectronic semiconductor component with individually controllable pixels emitting radiation, mounted on a carrier with transport channels for gas or liquid, allowing direct illumination of a light-curable printing liquid in a 3D printer, eliminating the need for intermediate optics and enhancing spatial resolution and printing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional 3D printing methods use sequential construction from powder baths with intermediate optics and imaging units, then the process is simpler to implement, but the spatial resolution is limited and productivity is low
Solution Approach 1:
The patent removes intermediate optics and imaging units from the conventional 3D printing system. The semiconductor component directly projects radiation patterns onto the powder bath, eliminating the need for complex optical systems while improving spatial resolution through precise pixel control.
Solution Approach 2:
The patent replaces mechanical optical systems with a semiconductor-based radiation emission system. The semiconductor component with controllable pixels directly generates and projects radiation patterns, substituting complex mechanical optics with a more precise and compact solid-state device.
2Productivity
If conventional 3D printing methods use sequential construction processes, then the device structure is simpler, but the productivity is slow and uneconomic for large-scale production
Solution Approach 1:
The patent implements continuous liquid supply through transport channels that deliver binding agent or liquid directly to the radiation exit side during the printing process. This continuous supply enables sustained high-speed operation without interruption, significantly improving productivity for large-scale production.
Solution Approach 2:
The semiconductor component is pre-configured with integrated transport channels during manufacturing. These channels are built into the carrier structure before the component is assembled, allowing immediate continuous operation without requiring external liquid supply systems or complex assembly procedures.
3Productivity
If the semiconductor component uses transport channels for liquid supply, then the productivity and printing speed are accelerated, but the device complexity increases
Solution Approach 1:
The patent merges the transport channel system with the carrier structure of the semiconductor component. The channels are integrated into the same component that houses the radiation-emitting pixels, combining multiple functions (radiation emission and liquid transport) into a single unified device, thereby reducing overall system complexity.
Solution Approach 2:
The semiconductor component serves multiple functions simultaneously: it generates radiation patterns through controllable pixels and transports binding agent or liquid through integrated channels. This multi-functional design eliminates the need for separate liquid supply systems, reducing overall device complexity while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high spatial resolution and accelerated 3D printing by directly curing light-curable printing liquids, reducing production time and costs for large-scale 3D object manufacturing.
Implementation Method 1
The pixels are each formed from or with at least one semiconductor material... the pixels are designed to emit radiation having a wavelength of maximum intensity of at most 470 nm or 420 nm or 380 nm or at least 200 nm or 300 nm or 330 nm
Implementation Method 2
a light-curable printing liquid is used, from which an object to be produced is constructed. The liquid is preferably illuminated optically directly layer by layer by the individual pixels, so that the object to be produced is composed of the illuminated and thus cured regions of the printing liquid
Data Source
AI summary
An optoelectronic semiconductor component and a 3D printer are disclosed. In an embodiment the component includes a carrier and a plurality of individually controllable pixels, wherein the pixels are mounted on the carrier and are formed from at least one semiconductor material, and wherein the pixels are configured to emit radiation having a wavelength of maximum intensity of 470 nm or less.