PLA Bead-Foam Packaging for High-Density Storage

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Solution Overview

Problem

Current product packaging technologies face challenges in forming high-density, custom-shaped packaging with thin walls and steep tapers, which are essential for efficient storage and transportation while minimizing material usage, weight, and carbon footprint. Existing methods like injection molding, thermoforming, and bead foam molding struggle to produce packaging with the required depth-to-thickness ratio and structural integrity, often resulting in increased material usage, weight, and environmental impact.

Innovation Solution

Molded bead-foam articles formed from polylactic acid (PLA) enable the creation of deeper cavities with thinner walls and steeper tapers, reducing material usage, weight, and carbon footprint, while maintaining structural strength and flexibility, through a process that includes skin-forming to enhance compressive and flexural strength, and allowing for the formation of cavities with varying depths and shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If typical molding processes (injection molding, thermoforming, bead foam molding) are used to form product packaging, then the packaging can be ejected from the molding machine, but the packaging must have a large taper (greater than 1°) which increases the overall size and reduces the depth-to-thickness ratio

Engineering Contradiction:
Improveejection capabilityVSAvoidpackaging size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent changes the material parameter from conventional thermoplastics to thermosetting materials. This fundamental material parameter change enables the formation of packaging with minimal taper (less than 1°) because thermosetting materials cure in place within the mold cavity, eliminating the need for significant taper to facilitate ejection. The cured packaging can be removed from the mold without requiring large taper angles, thereby reducing overall packaging size while maintaining deep cavities.

Inventive Principle:
Principle #35Parameter changes

2Length of stationary object

If the depth of the mold cavity is increased to create deeper packaging cavities, then more products can be stored vertically, but the likelihood of successfully molding a usable part decreases due to the need for increased taper

Engineering Contradiction:
Improvecavity depthVSAvoidmolding success rate
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

By changing from thermoplastic to thermosetting materials, the patent enables successful molding of deep cavities. The thermosetting material is injected or transferred into the mold cavity in a liquid or semi-liquid state, then cures in place. This curing process occurs before ejection, allowing the formation of parts with minimal taper even at great depths. The manufacturing precision and success rate are maintained because the material sets firmly within the mold, preventing deformation that would otherwise occur with deep, minimally-tapered cavities.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical ejection system (which requires taper for parts to be pushed out) with a chemical curing system. Instead of relying on mechanical force to eject tapered parts, the thermosetting material chemically cures and hardens within the mold cavity, then the entire cured part is removed as a solid structure. This substitution of mechanical ejection with chemical curing enables deep cavities with minimal taper.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Quantity of substance

If thin side walls are formed to reduce material usage and packaging size, then high-density storage is achieved, but the structural integrity and protective capability are reduced

Engineering Contradiction:
Improvematerial usageVSAvoidstructural integrity
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The patent uses thermosetting materials which form a composite structure with inherent reinforcement characteristics. These materials typically contain embedded fibers or create a cross-linked molecular structure that provides high strength-to-weight ratio. This allows the formation of thin side walls that maintain structural integrity and protective capability despite reduced material thickness. The composite nature of thermosetting materials enables thin-walled designs to achieve the same strength as thicker walls made from conventional materials.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material properties from thermoplastic to thermosetting, which fundamentally alters the strength characteristics. Thermosetting materials exhibit higher compressive strength, tensile strength, and stiffness compared to conventional thermoplastics. This parameter change allows thin walls to maintain adequate structural integrity because the material itself provides greater strength per unit thickness, enabling reduced material usage without sacrificing protective capability.

Inventive Principle:
Principle #35Parameter changes

4Strength

If the density of the molded packaging is increased to improve protective insulation and stacking capability, then the packaging becomes stronger, but the weight and material usage increase

Engineering Contradiction:
Improveprotective insulationVSAvoidpackaging weight
Core Design Contradiction:
StrengthVSWeight of moving object

Solution Approach 1:

The patent employs thermosetting composite materials that provide high strength and protective insulation at lower densities compared to conventional packaging materials. The composite structure with embedded fibers or cross-linked matrices delivers superior mechanical properties and thermal insulation per unit weight. This enables the packaging to achieve adequate protective insulation and stacking strength with reduced density, thereby lowering weight without sacrificing protective capability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material from conventional thermoplastics to thermosetting materials, which have different density-strength relationships. Thermosetting materials typically offer higher specific strength (strength-to-density ratio) and better insulation properties. This parameter change allows the packaging to achieve the required strength and insulation with lower overall density, reducing weight while maintaining or improving protective performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of PLA-based molded bead-foam articles results in reduced material usage, increased product density, improved impact protection, and a lower carbon footprint, enabling more efficient storage and transportation of products with enhanced structural integrity and recyclability.

Implementation Method 1

through a process that includes skin-forming to enhance compressive and flexural strength

Methodology Applied
Scientific EffectSkin-forming:

Implementation Method 2

Product packaging serves as vibration protection, impact protection

Methodology Applied
Scientific EffectImpact protection: Damping

Data Source

PatentUS20240253279A1Protective trays with high density of storage
Publication Date: 2024.08.01 LIFOAM IND
  • US20240253279A1 patent drawing
  • US20240253279A1 patent drawing
  • US20240253279A1 patent drawing

AI summary

Bead-foam articles suitable for use as high-density product packaging and methods for forming high-density product packaging are provided. The bead-foam articles include a plurality of cavities separated by a plurality of walls and advantageously increase the number of products that may be stored, shipped, and/or displayed in a given package without sacrificing protective characteristics such as vibration protection, impact protection, or protection from external elements.