Component Placement Device Remote Camera Alignment
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Solution Overview
Problem
Existing methods for placing components on substrates are time-consuming and prone to errors due to the need for a large distance between the placement device and the substrate to accommodate alignment devices, which increases the risk of inaccuracies during the placement process.
Innovation Solution
The method involves using a camera to image both the placement device and the substrate from a side remote from the substrate, allowing for direct determination of the relative positions and enabling the placement device to be positioned closer to the substrate, thus reducing the distance to be bridged and improving accuracy and speed of component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an alignment device is positioned between the placement device and the substrate, then the position of the component and substrate can be determined accurately, but the placement device must be at a relatively large distance from the substrate and the process becomes time-consuming
Solution Approach 1:
The patent removes the alignment device from the space between the placement device and substrate. Instead, a camera is used to capture an image from a remote position, extracting the measurement function from the physical space constraint and allowing the placement device to operate closer to the substrate without requiring intermediate alignment equipment.
Solution Approach 2:
The patent changes the dimensional approach by capturing a three-dimensional image from a remote position and using image processing algorithms to determine positions. This replaces the traditional two-dimensional optical alignment approach, allowing measurement without physical proximity between the camera and the placement device-substrate interface.
2Ease of operation
If the placement device is positioned at a relatively large distance from the substrate to accommodate the alignment device, then the alignment device can be positioned, but the placement accuracy decreases and the time to bridge the distance increases
Solution Approach 1:
The patent replaces the mechanical alignment system with an image-based measurement system. The camera captures images and software algorithms determine positions, replacing the need for mechanical alignment devices and their associated space requirements. This substitution allows the placement device to operate at optimal distances for precision without accommodating alignment equipment.
3Device complexity
If the placement device is positioned at a relatively large distance from the substrate, then the alignment device can be positioned, but the time to bridge the distance increases and placement speed decreases
Solution Approach 1:
The alignment device is extracted from the operational space, allowing the placement device to move directly to the substrate without the intermediate positioning and removal cycles. This extraction eliminates the time loss associated with accommodating alignment equipment and improves placement throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid and accurate placement of components by eliminating the need for intermediate alignment devices, reducing the distance between the placement device and the substrate, and enabling precise positioning through direct imaging and processing.
Implementation Method 1
an image of at least a part of the substrate comprising the desired position and of the placement device supporting the component is made by means of the camera from a side of the component remote from the substrate
Data Source
AI summary
A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.