Placing Table Temperature Control for Uniform Plasma Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, plasma processing apparatuses face challenges in uniformly adjusting the temperature of target objects due to non-uniform temperature distribution on placing tables, which affects the precision and efficiency of processes like deposition and etching.
Innovation Solution
A temperature adjustment method is implemented using a placing table divided into regions with temperature detectors and heat exchange chambers, where coolant pressure and flow rates are individually adjusted to achieve and maintain uniform temperatures across the table, with additional adjustments for heat generation and dryness fraction to enhance temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant pressure is adjusted uniformly across the placing table, then the overall temperature reaches the target range, but temperature non-uniformity across different regions persists
Solution Approach 1:
The placing table is divided into multiple regions (first region, second region, third region, fourth region) with separate heat exchange chambers for each region. This segmentation allows independent temperature control of each region through separate coolant flow rate adjustments, resolving the temperature non-uniformity issue while maintaining overall temperature control.
Solution Approach 2:
Different flow rates of coolant are supplied to different heat exchange chambers based on the specific temperature requirements of each region. This local quality approach enables precise temperature adjustment for each region, ensuring uniform temperature distribution across the entire placing table surface.
2Manufacturing precision
If multiple heat exchange chambers with individual flow rate control are implemented, then temperature uniformity is improved, but system complexity increases
Solution Approach 1:
A single chiller device serves all heat exchange chambers, providing universal cooling functionality. The chiller device circulates coolant to multiple regions simultaneously, reducing the need for multiple independent cooling systems while maintaining the ability to individually control flow rates to each chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently reduces temperature non-uniformity on the placing table, allowing for precise and uniform temperature adjustments, improving the accuracy and speed of semiconductor processing operations.
Implementation Method 1
The placing table is equipped with multiple heat exchange chambers each configured to perform heat exchange by a coolant circulating through a chiller device
Implementation Method 2
In the adjusting of the pressure of the coolant, the pressure of the coolant is adjusted such that the temperature of the placing table reaches a first temperature range
Implementation Method 3
In the individually adjusting of the flow rates of the coolant, after the adjusting of the pressure of the coolant, the flow rates of the coolant supplied to the multiple heat exchange chambers are adjusted respectively such that all of temperatures measured by the multiple temperature detectors reach the first temperature range
Data Source
AI summary
A temperature adjustment method includes adjusting a temperature of a placing table on which a target object is placed. The placing table is divided into regions and equipped with temperature detectors. The regions are set along a placing surface of the placing table. The temperature detectors are disposed in the regions, respectively. The placing table is equipped with heat exchange chambers each configured to perform heat exchange by a coolant. The heat exchange chambers are disposed in the regions, respectively. The adjusting of the temperature of the placing table includes adjusting a pressure of the coolant such that the temperature of the placing table reaches a first temperature range; and individually adjusting, after the adjusting of the pressure of the coolant, flow rates of the coolant supplied to the heat exchange chambers, respectively, such that all of temperatures measured by the temperature detectors reach the first temperature range.