Multi-Layer Plain Bearing Sputtering for Stronger Layer Adhesion

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Solution Overview

Problem

Existing methods for producing multi-layer sliding bearing elements using cathode sputtering face challenges with insufficient adherence of the deposited metal layer on the substrate, particularly when using materials that are difficult to mix, leading to poor bonding strength.

Innovation Solution

The method involves ion etching the substrate with the target acting as the anode, allowing substrate particles to deposit on the target, which are then reversed in polarity for metal layer deposition, creating a transitional zone with a mixture of substrate and target particles, enhancing adherence without the need for intermediate flushing or separate cleaning steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional cathode sputtering is used to deposit metal layer on substrate, then the metal layer can be formed, but the adherence of the deposited layer on the substrate is insufficient

Engineering Contradiction:
Improveadherence of metal layerVSAvoidbonding strength
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The substrate undergoes ion etching treatment before the metal layer deposition. This preliminary action removes surface oxides and contaminants from the substrate, creating a cleaner surface that enhances the subsequent adhesion of the metal layer. The ion bombardment activates the substrate surface, improving the bonding strength between substrate and deposited metal layer.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A transitional zone is created between the substrate and the metal layer through controlled ion etching and deposition processes. This transitional zone acts as an intermediary layer that facilitates the bonding between the substrate and the metal layer, particularly important when using materials that are difficult to mix. The transitional zone contains a gradient of material composition that improves interfacial adhesion.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If ion etching is performed to clean substrate surface, then adherence improves, but the process complexity increases due to additional steps

Engineering Contradiction:
ImproveadherenceVSAvoidprocess steps
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The ion etching step and the metal layer deposition step are merged into a single continuous process without intermediate flushing or separate cleaning steps. The target polarity is reversed between these steps, allowing the chamber to be used for both etching and deposition without requiring additional cleaning operations. This reduces process complexity while maintaining improved adherence.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The process maintains continuous useful action by transitioning directly from ion etching to metal layer deposition without idle flushing steps. The chamber atmosphere and process conditions are continuously adjusted through target polarity reversal, eliminating interruptions and maintaining productive operation throughout the sequence.

Inventive Principle:
Principle #20Continuity of useful action

3Stability of the object's composition

If materials that are difficult to mix are used for substrate and layer, then material properties are optimized, but adherence becomes insufficient

Engineering Contradiction:
Improvematerial propertiesVSAvoidbonding strength
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The transitional zone creates local quality variation at the interface between substrate and metal layer. While the bulk materials maintain their distinct properties (difficult to mix), the interface region develops a gradient composition through controlled ion bombardment and deposition. This local modification at the interface improves bonding strength without compromising the bulk material properties.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The structure formed is essentially a composite with three distinct regions: the substrate, the transitional zone with mixed materials, and the metal layer. The transitional zone acts as an intermediate composite layer that bridges the two difficult-to-mix materials, enabling strong bonding while preserving the optimized properties of both bulk materials.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the adherence of the metal layer on the substrate by creating a transitional zone with a soft transition of materials, resulting in stronger mechanical clinging and bonding, and simplifies the production process by eliminating the need for intermediate flushing and separate cleaning.

Implementation Method 1

depositing the metal layer on the substrate, whereto target particles are produced from at least one target that is connected as the cathode, said particles being settled on the substrate

Methodology Applied
Scientific EffectCathode sputtering: Sputtering

Implementation Method 2

ion etching of the surface of the substrate to be coated by ion bombardment, whereby substrate particles are removed from the surface of the substrate

Methodology Applied
Scientific EffectIon bombardment: Ion Beam

Implementation Method 3

polarity of the target is then reversed for the deposition of the metal layer on the surface of the substrate

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS11286552B2Method for producing a multi-layer plain bearing element
Publication Date: 2022.03.29 MIBA GLEITLAGER AUSTRIA GMBH
  • US11286552B2 patent drawing

AI summary

The invention relates to a method for producing a multi-layer sliding bearing element (1), according to which, in a chamber of a cathode sputtering installation a metal layer is deposited on a substrate by means of cathode sputtering of at least one target, said method comprising the steps: introducing a substrate into the chamber of the cathode sputtering installation; ion etching of the surface of the substrate to be coated by ion bombardment, whereby substrate particles are removed from the surface of the substrate; depositing the metal layer on the substrate, whereto target particles are produced from at least one target that is connected as the cathode, said particles being settled on the substrate. In the step of ion etching of the substrate, the target is connected as the anode and at least some of the substrate particles are deposited on the target. The polarity of the target is then reversed for the deposition of the metal layer on the surface of the substrate.