Planar Antenna Device With Buried Low Resistivity Layer
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Solution Overview
Problem
Existing RF communication equipment antenna devices face challenges in miniaturization due to electromagnetic disturbances between the antenna element and associated active and passive components, leading to bulkiness and limited integration capabilities.
Innovation Solution
The antenna device features a planar antenna element fixed to the substrate's back side with components integrated on the front side connected through via holes, utilizing a low resistivity buried layer for electromagnetic isolation, which also acts as a ground and potential reflector, allowing for miniaturization and integration of electronic functions on both sides of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the antenna element and active/passive components are spaced apart to reduce electromagnetic disturbances, then the harmful electromagnetic interference is reduced, but the antenna device becomes bulky and integration is prevented
Solution Approach 1:
The patent transitions from planar separation to three-dimensional integration by placing the antenna element on the back side of the substrate and components on the front side, utilizing the substrate thickness dimension to achieve both compact integration and electromagnetic isolation simultaneously
Solution Approach 2:
A low resistivity layer is introduced as an intermediary between the antenna element and the components to provide electromagnetic shielding and isolation, allowing close integration while maintaining low interference through the conductive barrier
2Object-affected harmful factors
If a truncated layer is used to isolate components from antenna radiations, then electromagnetic isolation is achieved, but the process becomes complex and expensive
Solution Approach 1:
The patent changes the electrical parameter of the substrate layer by creating a low resistivity region through doping or material selection, transforming it into an effective electromagnetic shield without requiring complex geometric structures or additional processing steps
3Ease of manufacture
If only one face of the carrier is used for integration, then the manufacturing process is simplified, but miniaturization is limited
Solution Approach 1:
The patent utilizes both faces of the substrate (front and back sides) for integrating different functional elements, effectively doubling the available integration area and enabling significant miniaturization while maintaining standard manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of the antenna device, enables integration of antenna elements and electronic components on a single carrier, and minimizes electromagnetic interference, suitable for high-frequency applications and consumer equipment.
Implementation Method 1
a low resistivity layer buried into the substrate for connecting to ground in order to isolate the group of at least one component from the electromagnetic disturbances that are induced by the antenna element
Implementation Method 2
a low resistivity layer buried into the substrate for connecting to ground
Implementation Method 3
a planar antenna element... this radiating element may be a slot antenna element... or a patch antenna element... or a transmission line
Data Source
AI summary
An antenna device (AD) for a RF communication equipment, comprises i) a substrate (S) comprising front (FS) and back (BS) sides, ii) a planar antenna element (AE) fixed to the substrate back side (BS), iii) a group of at least one component (G1) fixed to the substrate front side (FS), in an area located under the antenna element (AE), and connected to the antenna element (AE) through at least a first connecting means (VH 1) passing through the substrate (S), and a low resistivity layer (BL) buried into the substrate (S) for connecting to ground in order to isolate at least the group of component(s) from electromagnetic disturbances induced by the antenna element (AE).