Planar Antenna Via Segmentation for Reliability
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Solution Overview
Problem
Planar antennas face reliability issues due to the insufficient reliability of through holes in the electrical conduction between conductive plates, which can break under temperature changes or long use, leading to a deterioration in the suppression of parallel-plate mode propagation and radiation efficiency.
Innovation Solution
The design incorporates a multi-layered dielectric substrate with conductive vias in different layers, aligned along the normal line direction, to facilitate capacitive coupling between conductive planes, enhancing the aspect ratio and reliability of high-frequency current flow, thereby suppressing parallel-plate mode propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are provided for electrical conduction between conductive plates, then parallel-plate mode propagation is suppressed, but reliability deteriorates due to breaking from temperature change or long use
Solution Approach 1:
The patent divides the single through-hole structure into multiple segments: through holes in the first dielectric layer and through holes in the second dielectric layer. This segmentation allows each layer to have independent conduction paths, preventing complete failure even if some holes break, thus improving reliability while maintaining suppression of parallel-plate mode propagation.
Solution Approach 2:
The patent introduces conductive vias as intermediary elements that connect the through holes across different dielectric layers. These vias act as mediators to maintain electrical conduction continuity, ensuring that even if original through holes break, the conduction path can be maintained through the via structure, thereby improving reliability.
2Reliability
If through holes are provided to suppress parallel-plate mode propagation, then radiation efficiency is improved, but reliability deteriorates due to breaking from temperature change or long use
Solution Approach 1:
The patent segments the electrical conduction path into multiple through holes distributed across different dielectric layers. This segmentation provides redundant conduction paths, ensuring that radiation efficiency is maintained even if some individual holes break, as other paths remain functional.
Solution Approach 2:
The patent changes the structural parameters of the conduction system by introducing multiple through holes with specific dimensions and distributions in different dielectric layers. This parameter optimization ensures sufficient electrical conduction for maintaining radiation efficiency while improving reliability through redundancy.
3Reliability
If through holes are provided for electrical conduction, then parallel-plate mode propagation is suppressed, but manufacturing precision is worsened due to alignment requirements
Solution Approach 1:
The patent divides the alignment requirement into separate segments for different dielectric layers. Instead of requiring perfect alignment of a single continuous through-hole, the structure allows independent formation of through holes in the first and second dielectric layers, reducing the cumulative alignment precision requirement while maintaining suppression effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of suppressing parallel-plate mode propagation and enhances the radiation efficiency of the planar antenna by maintaining the effectiveness of capacitive coupling even with varying thermal expansion coefficients, ensuring consistent performance.
Implementation Method 1
conductive vias in different layers, aligned along the normal line direction, to facilitate capacitive coupling between conductive planes
Implementation Method 2
a parallel-plate mode generated by the excitation of the radiating element propagates. In order to suppress the propagation and to improve various characteristics of the antenna
Data Source
AI summary
A plane antenna device includes a multi-layered dielectric substrate having a plurality of dielectric layers; a first conductive plane on or in the multi-layered dielectric substrate; a second conductive plane on or in the multi-layered dielectric substrate, wherein at least first and second dielectric layers of the plurality of dielectric layers are disposed between the first and second conductive planes; a first signal line being between the at least first and second dielectric layers, the first signal line being between the first conductive plane and the second conductive plane; a first conductive via in the first dielectric layer, the first conductive via being distanced from the first signal line; and a second conductive via in the second dielectric layer, the second conductive via being distanced from the first signal line, the second conductive via being aligned to the first conductive via.