Planar Busbar Assembly Insulation Using Gap-Filled Resin
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Solution Overview
Problem
Existing laminated-type busbar assemblies face challenges in ensuring reliable electric insulation and mechanical connection between busbars, particularly when the insulating resin is thin, leading to potential leakage currents and instability.
Innovation Solution
A manufacturing method for busbar assemblies involving conductive flat plates arranged in parallel with an insulative resin layer, including a gap filling portion and a bottom-surface-side laminated portion, with exposed top and bottom connection portions, utilizing laser light irradiation and insulating layer formation to enhance insulation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the insulating resin between busbars is made thin to downsize the busbar assembly, then the vertical size is reduced, but the electric insulation reliability deteriorates and leakage current may occur
Solution Approach 1:
The patent transitions from a laminated-type structure (vertical stacking of busbars with thin insulating resin) to a planar-type structure (busbars arranged in the same plane with gaps). This dimensional change allows the insulating structure to extend laterally rather than vertically, achieving both downsizing and maintained insulation reliability through the insulative resin layer covering top surfaces and filling gaps between busbars
2Stability of the object's composition
If laser light irradiation is applied to expose the second bottom surface region, then the mechanical stability and parallelism are improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent replaces mechanical machining methods with laser light irradiation to expose the second bottom surface region. This substitution achieves precise exposure of the busbar bottom surfaces for optimal parallelism and mechanical stability while simplifying the manufacturing process through the precision and controllability of laser technology
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables efficient production of busbar assemblies with improved electric insulation and mechanical stability, preventing leakage currents and ensuring stable parallelism and fixation, suitable for semiconductor modules.
Implementation Method 1
a laser beam irradiation step of irradiating a laser beam to at least an entire area of a second-bottom-surface-region forming area corresponding to the second bottom surface region within a range not including the slit to expose the entire area of the second-bottom-surface-region forming area
Data Source
AI summary
According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.