Planar Busbar Assembly With Resin-Filled Gap for Insulation
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Solution Overview
Problem
Conventional busbar assemblies face challenges in maintaining sufficient electrical insulation and mechanical connection reliability, particularly when attempting to miniaturize, as the insulating resin between busbars can be too thin, leading to potential leakage currents and limitations in semiconductor element arrangement due to the gap width between busbars.
Innovation Solution
A busbar assembly design featuring conductive flat plate busbars arranged in a common plane with a gap filled by an insulating resin layer, including a gap filling part and upper surface laminated parts that expose predetermined areas of the busbars, allowing for a reduced gap width while maintaining effective insulation and enabling efficient semiconductor element arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the insulating resin between busbars is made thin to downsize the busbar assembly, then the vertical size is reduced, but the electrical insulation reliability deteriorates due to risk of leakage current
Solution Approach 1:
The patent transitions from a vertical laminated arrangement to a planar arrangement where busbars are disposed in the same plane. This dimensional change allows the assembly to be compact in the vertical direction while maintaining sufficient horizontal spacing between busbars for reliable electrical insulation, thus resolving the contradiction between miniaturization and insulation reliability.
Solution Approach 2:
The insulating resin layer is segmented into a gap filling portion that fills the gap between busbars and a surface laminated portion that covers the upper surfaces. This segmentation allows the gap filling portion to provide adequate insulation distance in the horizontal direction, enabling reduced vertical size while maintaining insulation reliability.
2Productivity
If the gap width between busbars is reduced to enable more semiconductor element mounting, then the aggregate arrangement of semiconductor elements is improved, but the electrical insulation between busbars deteriorates
Solution Approach 1:
By arranging busbars in the same plane rather than vertically laminating them, the patent enables more semiconductor elements to be mounted in the vertical direction while maintaining adequate horizontal gap width for electrical insulation. The planar configuration optimizes space utilization for semiconductor element placement.
Solution Approach 2:
The insulating resin layer has different functions in different regions: the gap filling portion provides electrical insulation by filling the horizontal gap between busbars, while the surface laminated portion provides mechanical protection and insulation coverage on upper surfaces. This local differentiation allows optimized gap width for both insulation and semiconductor element arrangement.
3Device complexity
If conventional laminated-type busbar assembly is used, then vertical stacking is achieved, but sufficient electrical insulation reliability cannot be ensured due to thin insulating resin
Solution Approach 1:
The patent abandons the vertical laminated configuration in favor of a planar configuration where busbars are disposed in the same plane. This dimensional change allows the insulating resin to effectively fill horizontal gaps between busbars, providing sufficient electrical insulation path length and reliability that cannot be achieved in vertical stacking with thin resin layers.
Solution Approach 2:
The insulating resin layer is divided into gap filling portion and surface laminated portion. The gap filling portion specifically addresses the insulation reliability issue by filling the horizontal gap between busbars with sufficient resin material, creating an extended insulation path that prevents leakage current while maintaining the compact vertical stacking appearance.
Data Source
AI summary
A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.