Planar Busbar Assembly with Insulating Resin Slit
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Solution Overview
Problem
Conventional busbar assemblies face challenges in ensuring reliable electrical insulation and efficient manufacturing, particularly due to the need for multiple molds and difficulties in spreading insulating resin between flat surfaces, which complicates the manufacturing process and reduces efficiency.
Innovation Solution
A method involving a conductive metal flat plate with a slit formed in the busbar assembly region, coated with an insulating resin, and then cured to create an insulating resin layer that electrically insulates and mechanically connects busbars, allowing precise positioning and efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laminated type busbar assembly is used with vertically separated flat plate busbars, then electrical insulation between busbars is achieved, but manufacturing efficiency deteriorates due to the need for multiple molds and complex assembly processes
Solution Approach 1:
The invention divides the busbar assembly into a first busbar and a second busbar that are integrated into a single substantially planar body, rather than using vertically laminated separate components. This segmentation allows the busbars to be arranged in a planar configuration with insulating resin between them, eliminating the need for complex vertical stacking and multiple molds while maintaining electrical insulation.
Solution Approach 2:
The invention merges the first busbar and second busbar into a single substantially planar body, integrating multiple busbar components into one unified structure. This combining approach allows the busbars to be manufactured together as a single piece rather than assembling separate vertically laminated components, significantly improving manufacturing efficiency while maintaining electrical insulation through insulating resin placement.
2Reliability
If multiple separate busbar components are vertically laminated, then electrical insulation is achieved, but device complexity increases due to the need for multiple molds and securing structures
Solution Approach 1:
The invention segments the busbar structure into a planar configuration where the first and second busbars are arranged side-by-side in the same plane rather than vertically stacked. This segmentation approach simplifies the manufacturing process by eliminating the need for multiple vertically stacked molds and complex securing structures, while insulating resin is placed between the busbars to maintain electrical insulation.
Solution Approach 2:
Instead of vertically laminating busbars one above the other as in conventional designs, the invention inverts the arrangement by placing busbars side-by-side in a substantially planar body. This inversion of the vertical stacking approach simplifies the manufacturing process and reduces device complexity while maintaining electrical insulation through insulating resin placement between the planar busbars.
3Reliability
If insulating resin is injected between vertically separated busbars, then electrical insulation is achieved, but manufacturing precision deteriorates due to difficulty in spreading resin throughout the gap
Solution Approach 1:
The invention segments the insulating resin placement into a planar configuration where resin is positioned between side-by-side busbars in the same plane, rather than attempting to inject resin through vertically separated busbars. This segmentation approach improves manufacturing precision by allowing better control over resin distribution and placement, ensuring uniform insulation without the difficulties of vertical gap filling.
4Adaptability or versatility
If different molds are provided for various busbar specifications, then adaptability to different busbar shapes and sizes is achieved, but device complexity increases due to the need for multiple specialized molds
Solution Approach 1:
The invention creates a universal mold design that can manufacture busbars of different specifications (shapes and sizes) by forming a substantially planar body containing multiple busbars. This universal mold approach eliminates the need for multiple specialized molds for different busbar configurations, as the planar body structure can accommodate various busbar designs while simplifying the mold inventory required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable electrical insulation and efficient manufacturing of busbar assemblies by precisely positioning busbars and effectively using the insulating resin layer to connect them, enhancing manufacturing efficiency and adaptability to various busbar specifications.
Implementation Method 1
a busbar-side curing step of curing the coating material applied in the busbar-side coating step to form the insulating resin layer
Data Source
Figure 1A~1C
Figure 2
Figure 3A~3B
AI summary
A manufacturing method according to the present invention includes: a step of providing a first conductive metal flat plate (100); a step of forming a slit (125-125c) in a busbar assembly forming region (120) of the flat plate (100); a step of coating the flat plate (100) with a coating material containing an insulating resin such that at least the slit (125-125c) is filled with the insulating resin layer (30); a step of curing the coating material to form the insulating resin layer (30); and a cutting step of cutting off the insulating resin layer (30) in the slit (125-125c) and busbar forming parts (130) of the first conductive metal flat plate (100) from the first conductive metal flat plate (100), wherein the busbar forming parts (130) face each other with the slit (125-125c) therebetween.