Planar High-Capacitance Module for Uniform Heat Sink Contact
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Solution Overview
Problem
Current tantalum polymer capacitors face challenges in miniaturization due to height limitations and non-uniform heat sink installation, which affects heat dissipation efficiency.
Innovation Solution
A high capacitance module design that eliminates lead frames and allows adjustable height and layout, featuring capacitor cores on a flexible circuit board with an adhesive layer and conductive glue connections, ensuring uniform heat sink contact and reduced volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the capacitance of tantalum polymer capacitors is increased to meet power supply capacity demands, then the power supply capacity is improved, but the volume and size of the capacitor enlarge
Solution Approach 1:
The patent divides the capacitor into multiple capacitor cores (at least one, preferably multiple) arranged on the circuit board, each contributing to the total capacitance. This segmentation allows the system to achieve high power supply capacity through multiple smaller units rather than one large capacitor, thereby reducing overall volume while maintaining required power output.
Solution Approach 2:
The patent transitions from traditional vertical stacking arrangements to a planar arrangement on the circuit board, utilizing the two-dimensional space of the board to accommodate multiple capacitor cores. This dimensional change allows for increased capacitance without proportionally increasing the vertical height or overall volume of the capacitor assembly.
2Power
If the charging voltage is increased to meet power supply capacity demands, then the power supply capacity is improved, but the volume and size of tantalum polymer capacitors enlarge
Solution Approach 1:
By segmenting the capacitor into multiple cores, the patent enables the system to achieve required power supply capacity through distributed capacitance rather than relying on single high-voltage components. This segmentation allows for more efficient use of voltage and capacitance resources, maintaining power output while reducing individual component sizes and overall volume.
3Temperature
If heat sink is mounted on memory with different component heights, then heat dissipation is attempted, but the heat sink fails to contact uniformly with surfaces of capacitor and memory
Solution Approach 1:
The patent introduces an adhesive layer with adjustable thickness that can be tuned to compensate for height differences between components. This dynamic adjustment capability allows the heat sink to achieve uniform contact with both the memory and capacitor surfaces, ensuring effective heat dissipation while accommodating variations in component heights during manufacturing.
Solution Approach 2:
The patent changes the parameter of adhesive layer thickness to adjust the overall height of the capacitor assembly. By controlling the thickness of the adhesive layer, the patent can equalize the heights of different components, enabling the heat sink to contact all surfaces uniformly and improve heat dissipation efficiency.
4Reliability
If traditional capacitor structures with lead frames and molded housings are used, then electrical connection is achieved, but the volume and space occupied increase
Solution Approach 1:
The patent extracts and eliminates the lead frames and molded housings from the traditional capacitor structure. Instead, it uses direct metal contacts on the circuit board for electrical connection and an adhesive layer for mounting. This extraction of unnecessary structural elements significantly reduces the volume and space occupied while maintaining reliable electrical connection through the simplified design.
Solution Approach 2:
The patent replaces the mechanical lead frame structure with direct metal contacts and conductive adhesive bonds. This substitution eliminates the need for complex mechanical connection structures, reducing the overall volume while achieving reliable electrical connection through simplified contact points and adhesive bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves miniaturization and improved heat dissipation by allowing uniform heat sink contact and increased capacitance without enlarging volume, meeting power supply capacity demands.
Implementation Method 1
the at least one capacitor core having connection pins and being electrically connected to the metal contacts via a conductive glue
Implementation Method 2
an adhesive layer, covering the at least one capacitor core
Data Source
AI summary
A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.