Planar Clip Structure for Semiconductor Die Package Thermal Management

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Solution Overview

Problem

Conventional semiconductor die packages with conductive clip structures are costly and complex to manufacture due to non-planar designs requiring etching, stamping, and bending processes, and they lack efficient heat dissipation, making them unsuitable for smaller electronic devices.

Innovation Solution

A semiconductor die package design featuring a planar one-piece clip structure with a first and second portion connected by a removable tie bar, where the clip structure is molded with a semiconductor die and leadframe, allowing for simpler fabrication and improved thermal performance by exposing clip edges for heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional non-planar clip structures are used, then electrical connectivity is achieved, but manufacturing complexity and cost increase due to etching, stamping, and bending processes

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidclip structure complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The clip structure is divided into two substantially coplanar portions (first and second portions) connected by a tie bar, allowing each portion to be optimized for its specific electrical connection function while maintaining overall structural simplicity and planarity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of creating complex three-dimensional bent structures, the patent inverts the approach by using a planar configuration where both clip portions lie in substantially the same plane, eliminating the need for bending processes while achieving the same electrical connectivity function

Inventive Principle:

Principle #13The other way round (Inversion)

2Temperature

If conventional clip structures are used, then package assembly is achieved, but heat dissipation performance is insufficient

Engineering Contradiction:

Improveheat dissipationVSAvoidpackage structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The tie bar connecting the two clip portions is designed to be removable, allowing it to be extracted after serving its purpose during assembly. This creates an opening that enables direct attachment of heat sinks to the clip structure, significantly improving heat dissipation from power transistors

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The clip structure serves multiple functions: providing electrical connectivity through its two portions, enabling package assembly during manufacturing, and serving as a thermal conduction path for heat dissipation after the tie bar is removed, allowing direct heat sink attachment

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If conventional MLP footprint designs are used, then package compatibility is achieved, but production costs increase due to complicated processing

Engineering Contradiction:

Improvepackage compatibilityVSAvoidproduction cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent changes the geometric parameters of the clip structure by making it substantially planar with both portions in the same plane, while still maintaining compatibility with standard MLP footprints, thereby eliminating complex processing steps while preserving package compatibility

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS7972906B2Semiconductor die package including exposed connections

Publication Date: 2011.07.05 SEMICON COMPONENTS IND LLC

AI summary

A clip structure and semiconductor die package. The clip structure includes a first portion and a second portion, with a connecting structure located between the first and second portion. The clip structure is substantially planar. The semiconductor die package includes a semiconductor die located between a leadframe structure and a clip structure. Slots are formed within the molding material covering portions of the semiconductor die package. The slots are located between a first portion and the second portion of the clip structure, and the slot overlap with the semiconductor die.