Planar Coil Voids Fixing Tool Heat Dissipation
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Solution Overview
Problem
Planar coils in semiconductor manufacturing devices experience instability due to heat generation from high-frequency electrical power, leading to unreliable holding on the base.
Innovation Solution
A planar coil design featuring a metal layer with voids and through holes, combined with a base and fixing tools, enhances heat dissipation and stability by allowing for better thermal management and secure fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-frequency electrical power is supplied to the coil to generate plasma, then plasma generation for wafer processing is achieved, but heat generation causes the coil to become unstable and unreliable on the base
Solution Approach 1:
The patent applies porous metal foam material for the coil structure. The porous structure provides high surface area to volume ratio, enabling efficient heat dissipation while maintaining the coil's electrical functionality for plasma generation. This resolves the contradiction by allowing high power operation without compromising stability through improved thermal management.
Solution Approach 2:
The patent uses composite construction combining metal foam with a base material (such as ceramic or metal substrate). This composite structure provides both the electrical conductivity needed for high-frequency power operation and the thermal stability required for reliable mounting on the base, thus resolving the contradiction between power capability and reliability.
2Power
If high-frequency electrical power is supplied to the coil, then plasma is generated for wafer processing, but heat generation causes thermal expansion and instability
Solution Approach 1:
The porous metal foam structure provides high thermal conductivity relative to its mass, enabling rapid heat dissipation that prevents thermal expansion and maintains dimensional stability during high-power operation. The porous structure allows heat to be quickly conducted away from the coil windings.
Solution Approach 2:
The patent changes the physical parameters of the coil by using metal foam with controlled porosity (typically 70-90% void space). This parameter change enables the coil to operate at high power while maintaining dimensional stability through enhanced heat dissipation capability, preventing thermal expansion issues.
3Strength
If the metal layer is made solid without voids, then structural strength is improved, but heat dissipation capability is reduced
Solution Approach 1:
The patent uses metal foam which appears porous but maintains structural strength through its three-dimensional cellular network. The interconnected struts and nodes provide mechanical strength while the high surface area to volume ratio of the porous structure enables superior heat dissipation compared to solid materials of the same mass.
Solution Approach 2:
The patent creates a composite structure where the metal foam is combined with a supportive base material. This composite provides both the structural strength needed for coil integrity and the heat dissipation capability through the porous architecture and thermal contact with the base, resolving the contradiction between strength and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the reliability and heat dissipation of the planar coil, ensuring stable operation during high-frequency electrical power application.
Implementation Method 1
a metal layer located on the first surface and including a through hole and a plurality of voids
Implementation Method 2
a plurality of voids... enhances heat dissipation
Implementation Method 3
a first fixing tool inserted through the through hole and fixing the metal layer to the first surface side of the base
Data Source
AI summary
A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).