Planar Coil Isolator Layout for Dielectric Breakdown Resistance
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Solution Overview
Problem
Existing isolators face challenges in preventing dielectric breakdown, particularly due to high electric field intensities at the outer and inner perimeters of the coils, which can lead to premature failure.
Innovation Solution
The isolator design includes a substrate with a first and second planar coil, insulating portions, and a metal layer arranged in a specific configuration to reduce electric field intensity at critical edges, thereby preventing dielectric breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a planar coil structure is used in the isolator, then the device complexity is reduced and manufacturing is simplified, but high electric field intensity concentrates at the outer and inner perimeters of the coils, leading to dielectric breakdown
Solution Approach 1:
The patent applies local quality by making the insulating portion asymmetric: the thickness in the radial direction varies at different locations. Specifically, the insulating portion has greater thickness at the outer perimeter and inner perimeter of the coil where electric field concentration occurs, while maintaining standard thickness in other areas. This localized thickening provides enhanced dielectric strength precisely where needed without unnecessarily increasing overall device complexity or manufacturing difficulty.
Solution Approach 2:
The patent employs asymmetry by designing the insulating portion with non-uniform thickness distribution. The insulating portion is asymmetrically configured relative to the coil structure, with increased thickness at critical high-field regions (outer and inner perimeters) and standard thickness elsewhere. This asymmetric design optimizes the balance between reliability enhancement and device simplicity, addressing the technical contradiction effectively.
2Reliability
If the insulating portion thickness is increased uniformly throughout, then dielectric breakdown resistance is improved, but the device size and manufacturing complexity increase
Solution Approach 1:
Rather than uniform thickening, the patent applies local quality by selectively increasing insulating portion thickness only at the outer and inner perimeters of the coil where electric field concentration occurs. The central region and other low-field areas maintain standard thickness. This localized approach improves dielectric breakdown resistance at critical points without proportionally increasing overall device complexity or manufacturing difficulty.
Solution Approach 2:
The patent applies partial action by thickening the insulating portion only where necessary (at the perimeters) rather than uniformly throughout. This partial thickening provides sufficient dielectric strength at high-field regions while avoiding the excessive material usage and manufacturing complexity that would result from uniform thickening across the entire insulating portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electric field concentration at the lower edges of the coils, enhancing the isolator's resistance to dielectric breakdown and improving its reliability.
Implementation Method 1
An isolator transmits a signal by utilizing the change of a magnetic field or an electric field in a state in which the current is blocked
Data Source
AI summary
An isolator includes a substrate; a first planar coil provided above the substrate and along a surface of the substrate; a first insulating portion on the first planar coil; a second planar coil on the first insulating portion; and a metal layer above the first insulating portion. The first planar coil, the second planar coil, and the metal layer are arranged in a first direction perpendicular to the surface of the substrate. The first planar coil and the second planar coil each having a center and an outer perimeter in a second direction along the surface of the substrate. A distance in the second direction from the center of the first planar coil to the outer perimeter of the first planar coil is less than a distance in the second direction from the center of the second planar coil to the outer perimeter of the second planar coil.