Planar Coil Module Manufacturing with Magnetic Resin Layers
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Solution Overview
Problem
Conventional printed wiring boards with built-in inductors require significant time and resources to manufacture, resulting in high costs and a thick profile, and are unable to handle large currents due to their design.
Innovation Solution
A method for manufacturing a module with a planar coil using a first resin layer with a built-in chip-type electronic component, a second resin layer with a magnetic or non-magnetic property, and a third resin layer to coat the planar coil, which includes a magnetic core, reducing manufacturing complexity and enabling the module to handle large currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional printed wiring board with a built-in inductor is used, then the inductor can be integrated into the board, but the manufacturing process becomes complex and costly due to the need for counterbore sections and through holes
Solution Approach 1:
The invention extracts the inductor from the conventional through-hole mounting structure and implements it as a planar coil pattern directly formed on the printed wiring board surface. This eliminates the need for counterbore sections and through holes, significantly simplifying the manufacturing process while reducing structural complexity
Solution Approach 2:
The invention transitions from three-dimensional through-hole mounting to two-dimensional planar coil integration on the board surface. This dimensional change eliminates the need for deep counterbores and complex assembly steps, reducing both manufacturing complexity and overall board thickness
2Productivity
If through holes and counterbore sections are formed for mounting the inductor, then the inductor can be integrated, but the manufacturing time and cost increase significantly
Solution Approach 1:
The invention merges the inductor manufacturing process with the printed wiring board fabrication process. The planar coil is formed using the same lamination and etching steps as the board itself, eliminating separate inductor assembly operations and significantly improving manufacturing efficiency
Solution Approach 2:
The inductor pattern is formed preliminarily during the board fabrication process itself, before final assembly. The coil pattern is created as part of the copper layer formation, so no additional time is required for separate inductor installation or wire winding operations
3Reliability
If a winding-based coil is used, then the inductor can be formed, but it cannot cope with large currents
Solution Approach 1:
The invention changes the physical parameters of the coil structure from wound wire to planar copper trace. This allows for increased conductor cross-sectional area and better heat dissipation, enabling the inductor to handle large currents reliably while maintaining electrical performance
4Length of stationary object
If the core becomes thick due to through-hole mounting, then the inductor can be assembled, but the profile is increased which is not preferred
Solution Approach 1:
The invention moves the inductor structure from vertical through-hole mounting to horizontal planar integration on the board surface. This dimensional transition dramatically reduces the overall profile thickness while maintaining inductive functionality, and simplifies assembly by eliminating the need for separate core and coil assembly steps
Data Source
AI summary
A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil.