Planar Coil Module Layout for Thin High-Current PCB Integration
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Solution Overview
Problem
Conventional printed wiring boards with built-in inductors require significant time and cost for manufacturing due to the need for counterbore sections and thick core structures, which are not suitable for reduced profiles and high current applications.
Innovation Solution
A method for manufacturing a module with a planar coil using a first resin layer with a built-in chip-type electronic component, a second resin layer with a magnetic or non-magnetic property, and a third resin layer to coat the planar coil, incorporating a magnetic core for enhanced performance without the need for through holes or counterbore sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional printed wiring board with a built-in inductor is manufactured using through holes, counterbore sections, and wound coils, then the coil can be mounted on the board, but the manufacturing time and cost increase significantly
Solution Approach 1:
The invention extracts the coil structure from the traditional wound form and implements it as a planar pattern directly formed on the circuit board surface. This eliminates the need for separate coil components, counterbore sections, and complex mounting processes, thereby significantly reducing manufacturing time while maintaining electrical functionality
Solution Approach 2:
The invention replaces the mechanical winding process with a planar trace pattern that can be manufactured using standard PCB fabrication techniques. This substitution eliminates the need for manual or automated winding operations, counterbore machining, and mechanical assembly, thereby reducing manufacturing complexity and time
2Reliability
If a through hole is mounted with a core member that penetrates the board and is joined with another core member, then the inductor function is achieved, but the board profile becomes thick
Solution Approach 1:
The invention transitions the inductor structure from a three-dimensional wound coil with penetrating core members to a two-dimensional planar pattern on the board surface. This dimensional change eliminates the need for thick core assemblies and through-hole penetration, thereby reducing the overall board profile thickness while maintaining inductive functionality through the planar trace geometry
3Reliability
If a wound coil is used for the inductor, then the inductor can be formed on the printed wiring board, but it cannot cope with large currents
Solution Approach 1:
The invention segments the current path into multiple parallel planar traces that form the inductor pattern. This segmentation increases the effective cross-sectional area for current flow and distributes the current load across multiple paths, thereby enhancing current handling capability while maintaining the planar structure
Solution Approach 2:
The invention changes the geometric parameters of the inductor by using wide planar traces with optimized width, length, and pattern configuration. This parameter optimization increases the current-carrying capacity of the traces while maintaining the required inductance value, enabling the structure to handle large currents effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, allows for a reduced profile, and enables the module to handle large currents effectively while maintaining high L and Q values, suitable for applications like non-contact electric power transmission and filter circuits.
Implementation Method 1
a second resin layer including a magnetic property or a non-magnetic property, and arranged on the first resin layer; a third resin layer including a magnetic property or a non-magnetic property, and coating the planar coil
Data Source
AI summary
A method for manufacturing a module including a planar coil, and a module including a planar coil, reduce manufacturing cost and also are able to handle a large current. The method for manufacturing the module including the planar coil includes the steps of providing a second resin layer including a magnetic filler on a first resin layer with a built-in chip-type electronic component; providing a planar coil on the second resin layer; and providing a third resin layer including a non-magnetic property so as to coat the planar coil.