Planar Spiral Coil Structure for Thin Inductors With Substrate Rigidity
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Solution Overview
Problem
There is a challenge in reducing the thickness of thin film coil components while maintaining appropriate inductance and DC resistance, as well as ensuring the insulating substrate provides sufficient rigidity.
Innovation Solution
A coil component design that includes an insulating substrate with a specific thickness ratio to the first conductive layer, allowing for high-capacity inductance and maintaining a certain level of rigidity while keeping the inductor profile low.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the insulating substrate is reduced to make the coil component thinner, then the profile of the inductor is reduced, but the rigidity of the insulating substrate deteriorates
Solution Approach 1:
The patent applies parameter changes by establishing a specific thickness ratio relationship between the insulating substrate (T1) and the first conductive layer (T2), where 10 ≤ T1/T2 ≤ 20. This quantitative parameter control allows the insulating substrate to be made thinner while maintaining sufficient rigidity through optimized dimensional proportions.
Solution Approach 2:
The patent employs composite materials by combining the insulating substrate with the first conductive layer and second conductive layer to form an integrated coil structure. This composite construction distributes mechanical stress and enhances overall structural rigidity, allowing the insulating substrate itself to be thinner without compromising the assembly's mechanical strength.
2Length of moving object
If the thickness of the insulating substrate is reduced to make the coil component thinner, then the profile of the inductor is reduced, but the inductance capacity deteriorates
Solution Approach 1:
The patent applies dimensionality change by utilizing a planar spiral configuration for the coil pattern instead of traditional three-dimensional winding. This allows the magnetic field to be generated in a two-dimensional plane, maximizing inductance capacity within a reduced thickness profile by efficiently utilizing the available planar space.
Solution Approach 2:
The patent optimizes inductance capacity through parameter changes by controlling the thickness ratio between the insulating substrate and conductive layers, and by optimizing the spiral coil geometry parameters such as trace width, spacing, and number of turns to achieve high inductance in a thin profile.
3Length of moving object
If the thickness of the insulating substrate is reduced to make the coil component thinner, then the profile of the inductor is reduced, but the DC resistance increases
Solution Approach 1:
The patent addresses DC resistance through parameter changes by optimizing the thickness of the first conductive layer relative to the insulating substrate (maintaining T1/T2 between 10 and 20), ensuring sufficient conductor cross-sectional area for low resistance while keeping the overall component thin.
Solution Approach 2:
The patent uses composite material construction with multiple conductive layers (first and second conductive layers) stacked on the insulating substrate, creating parallel current paths that reduce overall DC resistance while maintaining a thin profile through vertical integration of conductive elements.
Data Source
AI summary
A coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (T1) of the insulating substrate and a thickness (T2) of the first conductive layer satisfy 10≤T1/T2≤20.