Planar Coil Module Layout for Thin Wireless Charging Devices
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Solution Overview
Problem
The existing coil modules in electronic devices, such as mobile phones and tablets, have a large thickness due to the stacking of coils and heat dissipation plates, which increases the overall size of the device.
Innovation Solution
The first coil and heat dissipation plate are disposed at the same layer, with additional coils and heat dissipation plates stacked or connected in series/parallel configurations to enhance wireless charging and heat dissipation, reducing the thickness of the coil module and electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coil and heat dissipation plate are stacked in separate layers, then the wireless charging function and heat dissipation function can be independently implemented, but the thickness of the coil module increases
Solution Approach 1:
The patent merges the coil and heat dissipation plate into the same layer, allowing both wireless charging and heat dissipation functions to be implemented simultaneously without increasing module thickness. The coil pattern is designed to incorporate heat dissipation pathways directly within the coil structure, eliminating the need for separate stacking layers.
Solution Approach 2:
The patent transitions from a three-dimensional stacked arrangement to a two-dimensional planar integration, where the coil and heat dissipation plate coexist in the same layer. This dimensional change allows both components to share the same space without interfering with each other's functionality.
2Reliability
If the coil and heat dissipation plate are stacked in separate layers, then each component can be optimized independently, but the overall size of the electronic device increases
Solution Approach 1:
The patent combines the heat dissipation plate with the coil structure in the same layer, allowing both components to share the same spatial footprint. This merging reduces the overall area required for the coil module while maintaining independent optimization of both wireless charging and heat dissipation functions.
Solution Approach 2:
The coil structure is designed to serve multiple functions simultaneously: wireless charging through electromagnetic induction and heat dissipation through integrated thermal pathways. This multi-functionality eliminates the need for separate dedicated spaces for each function, reducing the overall device size.
3Reliability
If multiple coils are added to improve wireless charging effect, then the wireless charging performance increases, but the impedance of the coil module increases
Solution Approach 1:
The patent divides the coil system into multiple independent coil patterns within the same layer, each contributing to wireless charging. By segmenting the coil structure and optimizing the distribution of multiple coils, the system achieves improved charging effect while managing impedance through proper spatial arrangement and electrical connection design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement reduces the thickness of the coil module and electronic device while improving wireless charging efficiency and heat dissipation by optimizing the placement and connection of coils and heat dissipation plates.
Implementation Method 1
The first heat dissipation plate and the second heat dissipation plate are configured to dissipate heat from the heat source
Implementation Method 2
The first coil is configured to perform wireless charging
Data Source
AI summary
A coil module and an electronic device include a first heat dissipation plate that is configured to dissipate heat from a heat source, a first coil and the first heat dissipation plate are disposed at a same layer, and the first coil is configured to perform wireless charging. In comparison with a manner in which a coil and a heat dissipation plate are stacked, the first coil and the first heat dissipation plate are located on a same plane, so that a thickness of the coil module is reduced, thereby reducing a thickness of the electronic device, and reducing a size of the electronic device.