Planar Coil Wiring Component for Uniform Electrolytic Plating
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Solution Overview
Problem
Existing methods for forming planar coils, such as IC tags and NFC antennas, face challenges with film thickness distribution issues due to electrolytic plating, particularly in spiral patterns, where the inner peripheral end often has insufficient plating thickness compared to the outer peripheral end, leading to non-uniform film thickness and resistance differences.
Innovation Solution
A wiring component design that includes a base material with a planar coil pattern featuring a coil wiring portion, a power-feed wiring portion connected to a middle position, and a connection wiring portion that short-circuits the inner peripheral end, reducing the distance from the feeding point to the inner peripheral end, thereby promoting plating deposition and minimizing film thickness differences between the inner and outer ends.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electrolytic plating is performed on a spiral pattern coil, then the plating thickness at the outer peripheral end is sufficient, but the plating thickness at the inner peripheral end becomes insufficient, causing film thickness distribution
Solution Approach 1:
The patent divides the coil pattern into multiple segments by introducing connection wiring portions that create multiple feeding points. Instead of a single continuous spiral, the coil is segmented into multiple loops, each with its own feeding point, thereby reducing the maximum distance from any point to a feeding point and improving film thickness uniformity.
Solution Approach 2:
The patent introduces connection wiring portions as intermediary elements that electrically connect different parts of the coil pattern to multiple feeding points. These connection wiring portions act as mediators to distribute current more evenly throughout the coil, ensuring uniform plating thickness.
2Manufacturing precision
If a negative electrode bar is used to short-circuit each turn of the coil pattern during electrolytic plating, then film thickness uniformity is improved, but plating growth at contact positions is suppressed, causing non-uniform film thickness distribution
Solution Approach 1:
The patent performs preliminary design of the coil pattern with pre-calculated optimal positions for connection wiring portions and feeding points. The connection wiring portions are strategically placed at positions that prevent suppression of plating growth, ensuring both film thickness uniformity and plating quality consistency.
3Manufacturing precision
If the wiring length from the feeding point to the inner peripheral end is reduced, then film thickness difference is reduced, but the coil pattern structure becomes more complex
Solution Approach 1:
The patent segments the continuous spiral coil into multiple smaller loops by introducing connection wiring portions. This segmentation reduces the maximum wiring length from the feeding point to any part of the coil, thereby reducing film thickness difference while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for the formation of planar coils without the need for etching resist patterning, reduces film thickness differences at both ends, and enhances the electrical resistance uniformity, resulting in a high-quality, cost-effective manufacturing process.
Implementation Method 1
a conductive layer formed on the base resin layer
Implementation Method 2
when the planar coil is formed by electrolytic plating
Data Source
AI summary
Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.