Planar Conductive Laminates for Solar Cell Packages
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Solution Overview
Problem
Current solar cell package designs face limitations in durability, mechanical integrity, electrical connectivity, thermal transfer, and manufacturing cost due to the use of ceramic substrates and complex soldered interconnections, which restrict package usage and increase costs, especially with limited supplier options and vertical stacking of components.
Innovation Solution
A stacked component solar cell package with planar conductive laminates integrated with the heat sink, eliminating the need for ceramic substrates and allowing for more efficient heat dissipation and electrical connections without complex soldering, enabling a lower profile and more versatile packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic substrates (ALN, BeO) are used for thermal conduction, then thermal transfer is improved, but manufacturing cost increases and supplier options are limited
Solution Approach 1:
The patent changes the material parameter from ceramic substrates to metal substrates with copper heat spreaders, achieving comparable thermal performance through different material properties. The copper heat spreader with high thermal conductivity (400-4000 W/mK) replaces the ceramic substrate function while enabling standard manufacturing processes
Solution Approach 2:
The invention uses readily available, inexpensive metal substrates and copper heat spreaders instead of expensive, limited-supply ceramic substrates. These materials can be sourced from standard suppliers and manufactured using conventional processes, dramatically reducing cost and improving ease of manufacture
2Temperature
If vertical stacking of chip, substrate, and heat sink is used, then thermal conduction path is established, but package profile increases and hermetic sealing becomes difficult
Solution Approach 1:
The patent transitions from vertical stacking to a planar configuration where the copper heat spreader extends laterally beneath the solar cell. This dimensional change spreads the thermal conduction path across the horizontal plane rather than concentrating it vertically, reducing package height while maintaining thermal effectiveness
Solution Approach 2:
The thermal management system is segmented into distinct functional layers: the solar cell sits on an electrically isolated substrate, while the copper heat spreader is positioned below to collect and dissipate heat. This segmentation allows each component to be optimized for its specific function without compromising the other
3Reliability
If complex soldered interconnections with plastic packaging are used, then electrical connectivity is achieved, but manufacturing complexity increases and reliability decreases
Solution Approach 1:
The invention extracts and eliminates the plastic packaging and complex soldered interconnections from the assembly. Electrical connections are achieved through direct bonding of the solar cell contacts to the copper heat spreader and substrate, removing unnecessary components and simplifying the manufacturing process while improving reliability
Solution Approach 2:
The patent merges the electrical connection function with the thermal management structure. The copper heat spreader serves dual purposes: it provides the electrical connection path from the solar cell contacts while simultaneously functioning as the heat dissipation component, eliminating the need for separate interconnection elements
4Productivity
If maximum platform size of 4.5 inches × 4.5 inches is maintained, then current manufacturing capacity is preserved, but raw materials input increases and throughput efficiency decreases
Solution Approach 1:
The patent changes the platform size parameter to exceed 4.5 inches × 4.5 inches, enabling larger solar cells to be processed on a single platform. This reduces the number of platforms needed for a given production volume, decreasing raw materials consumption and improving throughput efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances durability, reduces manufacturing costs, and increases scalability and efficiency by allowing for more electrical connections and easier sealing, while simplifying the assembly process and enabling high-volume production with reduced material usage.
Implementation Method 1
The heat spreader is made of copper or copper alloy and has a thermal conductivity of at least 400 W/m-K, and more specifically at least 1000 W/m-K, and more specifically at least 2000 W/m-K, and more specifically at least 3000 W/m-K, and more specifically at least 4000 W/m-K
Data Source
AI summary
A stacked package for a solar cell is provided with a planar arrangement of conductive laminates on the surface of the heat sink. The layered conductive laminate offers multi-directional orientation of the solar cell within the package by eliminating any orientation requirements between the chip and the substrate, and offers multiple options for placement of standard or flipped bypass diodes. The packaged solar cell of the invention provides a smaller horizontal and vertical profile than standard solar cell packages, making it easier to hermetically seal the package.