Planar Crossover Coupler Layout for Wideband Millimeter-Wave Tuning

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Solution Overview

Problem

Traditional crossover couplers face significant challenges at millimeter-wave frequencies due to signal coupling issues, narrow operational bandwidth, high insertion loss, and poor E- and H-field management, which hinder their performance and scalability in high-frequency applications.

Innovation Solution

A compact, passive crossover coupler design using a dual-layer metal configuration with a cross-shaped geometry, featuring microstrip lines and slot openings, which allows for scalable bandwidth and coupling strength tuning without interconnect layers, reducing insertion loss and enhancing performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional crossover coupler designs are used at millimeter-wave frequencies, then the structure is simple and easy to manufacture, but signal coupling issues and high insertion loss occur

Engineering Contradiction:
Improvesignal integrityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from planar 2D microstrip lines to 3D volumetric electromagnetic fields by introducing a waveguide cavity with metallic posts. This dimensional change enables millimeter-wave operation with improved signal integrity by confining and controlling electromagnetic fields in three dimensions, resolving the signal coupling issues inherent in traditional planar designs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Metallic posts are introduced as intermediary elements between the input and output waveguides. These posts act as mediators that control and manage the electromagnetic field distribution, enabling precise coupling control and reducing insertion loss while maintaining signal integrity at millimeter-wave frequencies.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If traditional crossover coupler designs are used, then manufacturing is straightforward, but operational bandwidth is narrow

Engineering Contradiction:
Improveoperational bandwidthVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent employs adjustable parameters including metallic post dimensions, post positions, waveguide cavity dimensions, and substrate properties. By optimizing these parameters, the design achieves wide operational bandwidth at millimeter-wave frequencies while maintaining manufacturability through standard PCB fabrication techniques and conventional metallization processes.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If traditional crossover coupler designs are used, then the structure is compact, but E- and H-field management is poor

Engineering Contradiction:
Improvefield managementVSAvoidfield control structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Metallic posts serve as field management intermediaries that actively control both E-field and H-field distributions within the waveguide cavity. These posts create controlled discontinuities that manage field coupling between orthogonal modes, ensuring proper field management for millimeter-wave operation without requiring complex external field control structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves wideband operation with low insertion loss, improved signal integrity, and reduced production costs, facilitating integration in high-frequency systems like 5G and beyond, enabling miniaturization and efficient signal management.

Implementation Method 1

A first microstrip line may be substantially perpendicular to a second microstrip line, with the first microstrip line intersecting the second microstrip line in a first cross-shaped pattern

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

A gapped outer ring may surround the intersection point, with the gapped outer ring being divided by a first gap, a second gap, a third gap, and a fourth gap

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS20260045674A1Scalable planar crossover coupler with bandwidth and coupling strength tuning
Publication Date: 2026.02.12 DELL PROD LP
  • US20260045674A1 patent drawing
  • US20260045674A1 patent drawing
  • US20260045674A1 patent drawing

AI summary

The technology described herein is directed towards a wide-bandwidth, high-frequency (e.g., millimeter wave) crossover coupler. One implementation of the crossover coupler is passive, designed with a single top metallization layer and single bottom metallization layer, and does not require any interconnecting layer. The design of the top layer can include cross-shaped microstrip lines, and four inner partial couplers surrounded by four radial segments, which effectively direct the electromagnetic fields to the crossover circuit's ports. The bottom layer can include cross-shaped slot openings that can be sized to mitigate RF mismatch. Straightforward design tweaks can change the radio frequency (RF) characteristics of the crossover coupler, including, for example, selecting various design dimensions that determine the center frequency, bandwidth, coupling strength, and/or characteristic impedance of the crossover coupler, and can account for substrate permittivity and the height of the substrate.