Planar Diode Circuit Layout for Precise Rectenna Alignment
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Solution Overview
Problem
Existing manufacturing methods for rectennas require high precision to align metallic elements and diodes on a substrate, leading to functional failures due to misalignment and defects in bonding, which affects the conversion of electromagnetic waves into electrical energy.
Innovation Solution
A manufacturing method involving the formation of an insulation layer and a functional material layer on a substrate with complementary pattern shapes to improve the precision of the connection between the planar diode and circuit elements, ensuring proper alignment and function without the need for separate manufacturing processes for different components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two metallic elements are manufactured in two separate manufacturing processes, then each element can be produced with standard manufacturing methods, but misalignment occurs between the elements and the diode causing functional failure
Solution Approach 1:
The patent merges the manufacturing of multiple components (first metallic element, second metallic element, and diode) into a single integrated manufacturing process. The insulating layer is formed with a through-hole, and both metallic elements are deposited simultaneously or sequentially in the same process chamber, ensuring they are manufactured with the same precision reference and eliminating misalignment issues that occur when using separate manufacturing processes.
2Manufacturing precision
If two metallic elements are manufactured in a single manufacturing process, then alignment precision between elements is sufficient, but misalignment occurs between the elements and the diode due to separate manufacturing processes
Solution Approach 1:
The patent combines the manufacturing of the diode and metallic elements into a single process flow. The insulating layer is prepared with a through-hole pattern, then the metallic elements are deposited to form electrodes, and the diode structure is formed in the same process sequence, ensuring all components are manufactured with consistent precision and proper bonding alignment.
Solution Approach 2:
The insulating layer is pre-formed with a through-hole pattern that defines the precise location where metallic elements and diode will be connected. This preliminary structuring of the insulating layer establishes the alignment reference before the metallic elements and diode are manufactured, ensuring they will bond correctly without misalignment.
3Manufacturing precision
If high precision manufacturing is used to align metallic elements and diode, then functional performance is achieved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent simplifies the manufacturing process by combining multiple components into a single integrated fabrication sequence. Instead of requiring separate high-precision alignment steps for different components manufactured in different processes, all elements are manufactured together in one process, reducing overall complexity while maintaining high precision.
Solution Approach 2:
The insulating layer acts as an intermediary structure that provides a pre-defined through-hole pattern serving as an alignment template. This intermediary structure eliminates the need for complex post-manufacturing alignment procedures, as the through-hole pattern guides the precise placement and bonding of metallic elements and diode during the same manufacturing process.
Data Source
AI summary
A manufacturing method of a circuitry including a planar diode that can improve manufacturing precision of a connection between the planar diode and a circuit element connected to an electrode of the planar diode is provided. The manufacturing method of the circuitry including the planar diode includes: forming an insulating layer having a first pattern shape on a substrate; and monolithically forming a functional material layer having a second pattern shape complementary to the first pattern shape on the substrate. The functional material layer includes a material that functions as a planar diode having a rectifying property based on a shape and a size. The second pattern shape has a shape of a circuitry including the planar diode, a first circuit element connected to a first electrode of the planar diode, and a second circuit element connected to a second electrode of the planar diode.