Planar EBG Antenna Structure for Low-Cost Coupling Suppression
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Solution Overview
Problem
The high fabrication cost of three-dimensional mushroom-like electromagnetic band-gap (EBG) structures for preventing electromagnetic wave coupling between adjacent RF antennas, which limits their widespread adoption due to increased costs associated with metallic via fabrication.
Innovation Solution
A two-dimensional EBG structure fabricated on the surface of an antenna substrate with a periodic array of slots in the top conductive layer, which blocks surface waves in the E-band frequency range without requiring additional fabrication steps or modifications to the underlying substrate, thereby reducing coupling between adjacent antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If three-dimensional mushroom-like EBG structures with metallic vias are used to block electromagnetic waves, then the electromagnetic wave blocking performance is improved, but the fabrication cost increases significantly
Solution Approach 1:
The invention extracts the essential EBG functionality from the complex 3D mushroom structure with metallic vias and implements it using only planar conductive patterns on the PCB surface. This removes the expensive via fabrication requirement while maintaining the electromagnetic wave blocking capability through carefully designed conductive region arrangements that create the necessary phase cancellation effects.
Solution Approach 2:
The invention transitions from a three-dimensional EBG structure extending through the PCB thickness to a two-dimensional planar structure confined to the surface layer. This dimensional reduction eliminates the need for vertical via connections while preserving the electromagnetic band-gap functionality through in-plane conductive pattern design.
2Object-affected harmful factors
If 3D mushroom-like EBG structures are implemented, then coupling between adjacent antennas is reduced, but the device complexity and fabrication steps increase
Solution Approach 1:
The invention merges the EBG structure fabrication with the existing antenna PCB fabrication process. The same conductive layer and patterning steps used to create antenna elements are also used to create the EBG structures, eliminating separate fabrication steps and reducing overall device complexity while maintaining effective coupling reduction.
Solution Approach 2:
The invention segments the EBG functionality into discrete conductive regions arranged in specific patterns (such as periodic arrays of patches or strips). This segmentation allows the EBG structures to be integrated alongside antenna elements using the same fabrication processes, avoiding the need for continuous complex 3D structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 2D EBG structure effectively decreases mutual coupling between antennas, enhancing signal-to-noise ratio and detection range in radar sensing systems and improving beam uniformity in MIMO systems, while maintaining a low fabrication cost by integrating with existing antenna fabrication processes.
Implementation Method 1
A periodic array of two-dimensional electromagnetic band-gap (EBG) structures are also fabricated in the top conductive layer. The periodic array of 2D EBG structures is located between the first E-band antenna and the second E-band antenna, wherein each EBG structure includes a plurality of slots formed in the top conductive layer, wherein the periodic array of 2D EBG structures blocks surface waves in the E-band frequency range.
Data Source
AI summary
An electromagnetic band-gap (EBG) structure includes an antenna substrate layer, first conductive regions, and second conductive regions. The antenna substrate includes a first planar surface and a second planar surface. The first conductive regions are located on the first planar surface of the antenna substrate and separated from adjacent first conductive regions by a first distance. The second conductive regions are located on the first planar surface of the antenna substrate and are separated from the first conductive regions by a second distance and wherein the second conductive regions at least partially surround the first conductive regions.