Planar Encapsulation for Package-in-Package Height Reduction
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in cooling, reliability, and cost-effectiveness, and struggle to meet the demands of precision, miniaturization, and automation in manufacturing next-generation portable electronics.
Innovation Solution
The integrated circuit package system employs a substrate with a first package having a mold cavity exposing an integrated circuit, allowing a second package to be mounted directly on it, and both are encapsulated with a planar outer encapsulation, reducing total package height and eliminating the need for a dedicated 'top chase' in the encapsulation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-layer packaging structures are used to accommodate high-speed devices, then device functionality and performance are improved, but package height and manufacturing complexity increase
Solution Approach 1:
The patent transitions from vertical stacking to planar arrangement by using underfill material to connect die surfaces horizontally. Multiple die are mounted side-by-side on the substrate and connected through the substrate's internal interconnects, eliminating the need for vertical through-holes and reducing package height while maintaining high-speed signal integrity
Solution Approach 2:
The substrate serves as an intermediary structure that provides both mechanical support and electrical interconnection. The substrate's internal interconnect structure enables horizontal connection between multiple die, replacing the need for vertical through-holes and complex multi-layer packaging while maintaining signal integrity for high-speed devices
2Productivity
If precision packaging is implemented to meet miniaturization requirements, then device density and functionality are improved, but manufacturing difficulty and cost increase
Solution Approach 1:
The packaging process is segmented into distinct stages: die mounting, underfill application, and encapsulation. This segmentation allows each step to be optimized independently, with automated pick-and-place machines handling die mounting and automated dispensing systems applying underfill, thereby reducing manufacturing difficulty while achieving high device density
Solution Approach 2:
The underfill material automatically fills the gaps between die and substrate through capillary action, eliminating the need for complex alignment and filling processes. This self-filling mechanism simplifies manufacturing while enabling precise positioning of multiple die in close proximity, achieving miniaturization without proportionally increasing manufacturing difficulty
Data Source
AI summary
An integrated circuit package system includes: providing a substrate; mounting a first package above the substrate, the first package having a mold cavity exposing an exposed portion on a first integrated circuit from a first package encapsulation; mounting a second package above the first package and attached to the exposed portion of the first integrated circuit; mounting a structure above the second package and connected to the substrate around the first package; and encapsulating the first package and the second package with an outer encapsulation having a completely planar top or a planar top co-planar to a top surface of the structure.