Planar Filter Grounding Strategy for Parasitic Inductance Reduction
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Solution Overview
Problem
Conventional grounding strategies for electronic filters on planar substrates using microstrip or stripline technology introduce parasitic inductance, which deteriorates filter performance, especially at higher frequencies due to the proportional relationship between inductor reactance and frequency, and are limited by the number and placement of ground connections.
Innovation Solution
A grounding strategy that separates the ground connections for different groups of resonators, allowing each group to have distinct ground inductance, thereby reducing feedback effects and improving filter performance by generating additional transmission zeros in the stop-band that can be tuned for maximum attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple via holes are used to connect resonators to ground, then parasitic ground inductance is reduced, but manufacturing cost and process complexity increase
Solution Approach 1:
The invention divides the resonators into two groups, with each group connected to a separate ground connection. This segmentation allows independent ground paths for different resonator groups, reducing the total parasitic inductance without requiring multiple via holes per resonator, thus avoiding increased manufacturing complexity
Solution Approach 2:
The invention transitions from planar ground connections to three-dimensional sidewall terminations. By utilizing the vertical dimension and sidewall surfaces of the substrate, multiple ground connections can be established without increasing the planar footprint or requiring additional via hole etching processes
2Object-affected harmful factors
If additional wire-bonds are used to connect circuit nodes to ground, then parasitic ground inductance is reduced, but device area and complexity increase
Solution Approach 1:
The invention utilizes the vertical sidewall dimension of the substrate to create ground connections, eliminating the need for additional wire-bonds that would require enlarged bonding pads and access space. The sidewall terminations are formed as integral parts of the substrate structure, consuming minimal additional area
3Object-affected harmful factors
If sidewall terminations are used for ground connections, then ground connection capability is improved, but the number of available ground connections is limited
Solution Approach 1:
The invention segments the resonators into multiple groups, each group connected to different ground connections. This segmentation strategy maximizes the utilization of limited sidewall termination resources by strategically assigning resonators to different ground paths, thereby achieving effective reduction of parasitic inductance with the available ground connection count
Data Source
AI summary
The invention provides a grounding strategy for electronic components. In particular, the present provides ground connections in thin-film electronic components by connecting one group of one or more resonators to one ground connection and connecting a second group of one or more resonators to another ground connection.