Planar Grid Electrical Interface for High-Density Detachable Connections
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Solution Overview
Problem
Current pin-like electrical interface systems for implantable microelectrode arrays face challenges such as limited stack size, difficulty in assembly due to high aspect ratios, and increased insertion force, which can lead to breakage and seepage of molding compounds, resulting in discarded assemblies.
Innovation Solution
A high-density electrical interconnect apparatus with a housing and substrate element featuring independent substrate interface connect subassemblies arranged in a planar grid, utilizing pin and plug subassemblies with a lower aspect ratio to form multiple electrical communication channels, and a ribbon cable for connection to remote components, allowing for modular expansion and reduced insertion force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If contact devices are vertically stacked to increase connection density, then the number of contacts increases, but the aspect ratio of the insertion path increases making assembly difficult and prone to breakage
Solution Approach 1:
The patent transitions from a vertical stacking arrangement to a planar grid arrangement of contacts. This dimensional change allows multiple contacts to be organized in rows and columns on a flat substrate, eliminating the need for deep vertical insertion paths while maintaining high connection density. The contacts are accessed through a flat or minimally protruding interface rather than through a deep vertical stack.
Solution Approach 2:
The contact array is divided into multiple independent contact sites arranged in a grid pattern, each with its own insertion path. This segmentation allows for parallel assembly of multiple contacts without compounding the aspect ratio problem, as each contact can be inserted independently through its own optimized path rather than forcing a single long path through all contacts.
2Quantity of substance
If more contact devices are stacked vertically, then connection density increases, but the insertion force required increases linearly leading to pin breakage
Solution Approach 1:
By arranging contacts in a planar grid rather than vertical stack, the insertion force is distributed across multiple shallow insertion paths rather than compounding through a single deep path. Each contact requires minimal insertion force, and the total force required does not increase linearly with the number of contacts as it would in a vertical stack.
Solution Approach 2:
The patent uses a flat or minimally protruding contact interface that requires only partial insertion force to establish electrical contact, rather than requiring full penetration through a deep vertical stack. This reduces the force requirement for each contact while maintaining electrical connectivity.
3Volume of moving object
If contact devices are made smaller to reduce form factor, then device size decreases, but the probability of bending or breakage during pin insertion increases
Solution Approach 1:
The planar grid arrangement allows for optimized contact geometry where pins can be shorter and more robust, rather than requiring long, thin pins to reach through a vertical stack. The reduced insertion depth enables the use of shorter, thicker pins that are less prone to bending or breaking during assembly.
4Ease of manufacture
If contact stacks are held in position by external molding, then assembly is simplified, but molding compound seeps into the electrical contact area causing defects
Solution Approach 1:
The patent separates the electrical contact function from the structural support function. The contacts are mounted on a substrate that provides mechanical support, while the electrical contact area is designed to be accessible and protected from molding compound contamination. This extraction of functions allows for cleaner electrical interfaces without compromising assembly simplicity.
Data Source
AI summary
The present disclosure relates to a high density electrical interconnect apparatus for interfacing with remotely located electrical components. The apparatus may have a housing, a substrate element supported within the housing, and a plurality of independent substrate interface connect subsystems arranged in a planar grid on the substrate element. The apparatus further has a plurality of independent electrical interface connector subassemblies, each configured to be coupled to an associated subplurality of the substrate interface connect subsystems, to form a plurality of electrical communication channels with the remotely located electrical components.