Double-Sided Planar Heat Sink for Microchip Cooling
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Solution Overview
Problem
Existing air-cooled heat sinks and heat pipes are inadequate for dissipating the increased heat generated by high-power electronic components due to limited space and cooling capacity, necessitating more complex and less robust direct chip cooling technologies.
Innovation Solution
A planar heat sink with a channel structure configured to utilize both sides for cooling, featuring a meandering channel design with symmetric partition walls and sub-channels to enhance thermal conductivity and maintain consistent cooling power, produced via additive manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If air-cooled heat sinks are used, then the structure is simple and robust, but the cooling capacity is insufficient for high-power components
Solution Approach 1:
The heat sink utilizes both sides of the plate structure for cooling, transitioning from single-sided to double-sided heat dissipation. This dimensional utilization doubles the effective cooling area without proportionally increasing the volume or structural complexity, thereby significantly enhancing cooling capacity while maintaining structural simplicity
2Power
If direct chip cooling technology is used, then cooling effectiveness is improved, but the system becomes more complex and less robust
Solution Approach 1:
The plate-shaped heat sink serves multiple functions: it provides thermal coupling surfaces on both sides for mounting electronic components, contains the channel structure for cooling fluid flow, and acts as a structural support element. This multi-functionality achieves effective cooling without requiring separate dedicated components, thereby maintaining system robustness
3Power
If cooling space is increased to improve cooling capacity, then more heat can be dissipated, but the available server space is limited
Solution Approach 1:
By utilizing both sides of the plate structure for cooling, the effective cooling area is doubled without proportionally increasing the volume. The channel structure is integrated within the plate thickness, allowing high cooling power density within compact dimensions suitable for server installations
4Manufacturing precision
If a meandering channel structure with partition walls is implemented, then thermal conductivity and cooling consistency are enhanced, but manufacturing complexity increases
Solution Approach 1:
The meandering channel pattern and partition wall configuration optimize the thermal conductivity parameter by ensuring uniform heat distribution across the plate. The channel geometry is designed to maintain consistent flow velocity and heat transfer coefficients, achieving uniform cooling performance across both cooling surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high cooling power with minimal space requirements, enabling efficient heat dissipation and retrofitting existing IT infrastructures with improved thermal management.
Implementation Method 1
a first cooling plate (6) which is in thermal contact for the mounting of an electronic component in need of cooling
Implementation Method 2
a channel structure (3) for a cooling fluid
Implementation Method 3
heat sink which has a channel structure for a cooling fluid with a feed and a return
Implementation Method 4
dissipating the resulting power loss
Data Source
AI summary
A heat sink for at least one microchip having a heat-conducting heat sink which has a channel structure for a cooling fluid with a feed and a return, wherein the heat sink has, on two opposite outer sides, in each case one cooling plate which is coupled thermally and mechanically to the channel structure. Furthermore, a corresponding cooling arrangement is described.