Planar Heater for Liquid Ejecting Head Temperature Control
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Solution Overview
Problem
In liquid ejecting apparatuses, such as ink jet printers, the temperature management of the head main body is challenging due to temperature gradients caused by the interposition of a flow path body between the heater and the head main body, leading to inaccurate temperature control.
Innovation Solution
A liquid ejecting head design featuring a plurality of head chips with a nozzle surface, a thermally conductive holder, a thermally conductive flow path structure, and a planar heater disposed between the holder and the flow path structure, where the heater overlaps the head chips in a plan view, facilitating efficient heat transfer and reducing temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flow path body is interposed between the head main body and the heater, then the liquid flow path is protected and structured, but the distance between the heater and head main body increases causing temperature gradient and inaccurate temperature control
Solution Approach 1:
The head is divided into separate functional modules: head chips mounted on a holder, with the heater positioned between the holder and flow path structure. This segmentation allows the heater to be closer to the head chips while maintaining proper flow path structure through the holder's thermal conduction.
Solution Approach 2:
The holder acts as an intermediary component with high thermal conduction, transferring heat from the heater to the head chips efficiently. This mediator enables close thermal coupling while maintaining structural integrity and proper spacing for the flow path.
2Ease of manufacture
If the flow path body is interposed between the heater and head main body, then the liquid supply path is established, but heat transfer efficiency decreases due to increased distance
Solution Approach 1:
The holder serves as a thermally conductive intermediary that bridges the heater and head chips, enabling efficient heat transfer while maintaining the necessary flow path structure and spacing for proper liquid supply.
Solution Approach 2:
The heater is positioned in a different spatial arrangement - between the holder and flow path structure rather than directly against the head chips. This dimensional repositioning allows heat to transfer through the holder to the head chips, maintaining efficiency while accommodating flow path requirements.
3Measurement precision
If the heater is positioned closer to the head chips, then temperature control accuracy improves, but the flow path structure becomes more complex
Solution Approach 1:
The holder performs multiple functions simultaneously: it mechanically supports the head chips, provides thermal conduction from the heater, and facilitates liquid flow from the flow path structure. This multi-functionality simplifies the overall structure while achieving close temperature control.
Solution Approach 2:
The system is segmented into functional zones: the holder for thermal conduction and support, the flow path structure for liquid supply, and the heater for thermal control. This segmentation allows each component to be optimized for its specific function while working together as an integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature management of the head chips by efficiently transferring heat from the heater to the holder and flow path structure, thereby improving temperature uniformity and accuracy.
Implementation Method 1
a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure
Data Source
AI summary
A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.