Planar Heater Zones for Semiconductor Substrate Temperature Control

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Solution Overview

Problem

Semiconductor substrate processing requires precise and uniform temperature control to achieve critical dimension uniformity, which is challenging due to complex heat transfer dynamics and non-equilibrium phenomena in plasma processing, leading to non-uniformity in processing rates and device dimensions.

Innovation Solution

A heating plate with multiple independently controllable planar heater zones made of insulator-conductor composite materials, arranged in a scalable multiplexing layout, and connected through power supply and return lines to enable precise radial and azimuthal temperature control, compensating for adverse factors affecting critical dimension uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple independently controllable planar heater zones are implemented, then temperature profile uniformity and control precision are improved, but device complexity increases

Engineering Contradiction:

Improvetemperature profile uniformityVSAvoidheater zone configuration

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heating plate is divided into multiple independently controllable planar heater zones (first, second, third, and fourth zones) with distinct power supply and return lines for each zone. This segmentation allows independent temperature control of each zone, enabling precise spatial temperature profiling across the substrate while managing complexity through modular zone design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each planar heater zone can be independently controlled to provide different temperature profiles in different regions of the substrate. The local quality principle is applied by allowing each zone to have customized heating characteristics through independent power control, enabling compensation for local non-uniformities in heat transfer and plasma interactions

Inventive Principle:

Principle #3Local quality

2Reliability

If insulator-conductor composite materials are used in heater elements, then electrical insulation and thermal conduction are improved, but material fabrication complexity increases

Engineering Contradiction:

Improveelectrical insulationVSAvoidheater element fabrication

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The heater elements are constructed from insulator-conductor composite materials that combine electrical insulation properties with thermal conduction capabilities. This composite material approach resolves the contradiction by integrating both required functions (electrical insulation and thermal conduction) into a single material system, enabling reliable heater operation while maintaining manufacturability through established composite material fabrication techniques

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If scalable multiplexing layout is implemented for power supply lines, then temperature control versatility is improved, but electrical connection complexity increases

Engineering Contradiction:

Improvetemperature control flexibilityVSAvoidpower supply network

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The scalable multiplexing layout employs dynamic switching mechanisms that allow the same power supply and return lines to be selectively connected to different heater zones based on processing requirements. This dynamic reconfiguration capability provides versatile temperature control profiles without requiring dedicated lines for every possible zone combination, managing electrical connection complexity through intelligent switching architecture

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for active creation and maintenance of desired spatial and temporal temperature profiles, enhancing substrate processing uniformity and critical dimension consistency, even at sub-100 nm scales, by effectively managing heat transfer and plasma interactions.

Implementation Method 1

heater elements made from a conductor-insulator composite... operable to tune a spatial temperature profile on the substrate

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

heating plate... operable to tune a spatial temperature profile on the substrate... active creation and maintenance of desired spatial and temporal temperature profiles

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8680441B2Heating plate with planar heater zones for semiconductor processing

Publication Date: 2014.03.25 LAM RES CORP

AI summary

A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone includes one or more heater element made of an insulator-conductor composite. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic having planar heater zones, power supply lines, power return lines and vias.