Multi-State Planar Hinge Assembly for Seamless Bending
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Solution Overview
Problem
Conventional portable electronic devices lack an adjustable bending structure that can transition seamlessly between a compliant, flexible state and a rigid state, requiring significant energy for stiffness changes and often using bulky mechanisms.
Innovation Solution
A multi-state planar hinge assembly using a stack of interleaved layers that can change stiffness by adjusting the separation distance between layers, with an actuator providing frictional pressure in the compressed state, allowing for customizable rigidity and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional mechanisms are used to change stiffness, then stiffness adjustment is achieved, but energy consumption increases and device size becomes bulky
Solution Approach 1:
The patent changes the physical parameters of the hinge assembly by adjusting the separation distance between layers in the stack. When layers are separated, the hinge is compliant and flexible; when layers are compressed together, the hinge becomes rigid. This parameter change allows stiffness adjustment without bulky mechanisms or significant energy consumption, as the actuator only needs to apply frictional pressure to maintain the compressed state rather than continuously overcome mechanical resistance.
2Strength
If conventional mechanisms are used to change stiffness, then stiffness adjustment is achieved, but device size becomes bulky
Solution Approach 1:
The patent uses a stack of thin layers that can be compressed together to form a rigid structure or separated to form a flexible structure. This thin-film approach eliminates the need for bulky mechanical mechanisms while providing the required stiffness adjustment. The flexible nature of the layers allows them to adapt between compliant and rigid states without increasing device volume.
3Stability of the object's composition
If layers are compressed to maintain fixed angular displacement, then structural stability is improved, but thickness increases
Solution Approach 1:
The patent creates a dynamic hinge assembly where the separation distance between layers can be adjusted based on operational requirements. When a fixed angular displacement is needed, the layers are compressed together to provide stability. When flexibility is needed, the layers are separated to reduce thickness. This dynamic adjustment allows the hinge to adapt its thickness based on the required structural stability rather than maintaining a fixed thick structure for all conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a seamless transition between flexible and rigid states with minimal energy consumption, providing customizable stiffness and reducing the need for bulky mechanisms, suitable for various applications from laptop devices to wearable technology.
Implementation Method 1
a bending medium capable of (i) bending in response to an applied force and (ii) providing a resistance to movement in accordance with an amount of bending
Implementation Method 2
an actuator that applies frictional pressure to the stack of layers to a distance between the layers
Data Source
AI summary
A personal computing device comprises a single piece body having a seamless overall appearance and that includes a bendable portion that is capable of having a smoothly curved shape. The single piece body includes a first part capable of carrying a display suitable for presenting visual content, and a second part that is capable of carrying an input device suitable for accepting an input action. The personal computing device also includes a multi-state bending assembly carried by the single piece body at the bendable portion and positioned between and in mechanical communication with the first part and the second part. The multi-state bending assembly includes a planar assembly that, in a first state, is characterized as having a first thickness and allows relative movement of the first and second parts with respect to each other. In a second state, the planar assembly is characterized as having a second thickness, less than the first thickness, that is capable of maintaining a fixed angular displacement between the first and second parts.