Planar Inductance EBG for Bandwidth and Thickness
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Solution Overview
Problem
Existing electromagnetic band gap devices face challenges in miniaturization and thickness reduction while maintaining or expanding band gap bandwidth, often requiring increased conductor size or expensive high-permittivity dielectric materials, which complicates manufacturing and increases costs.
Innovation Solution
The design incorporates periodically arrayed conductor pieces connected through island electrodes and planar inductance elements, allowing for increased parallel inductance without increasing conductor post length, thereby reducing device thickness and size while expanding band gap bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductor post length is increased to increase parallel inductance L, then band gap bandwidth is widened, but device thickness increases
Solution Approach 1:
The patent transitions from vertical inductance (conductor posts extending in the thickness direction) to planar inductance elements (spiral or meander patterns extending in the horizontal plane). This dimensional shift allows increasing parallel inductance L without increasing device thickness, as the inductance is now generated in the XY-plane rather than the Z-direction.
Solution Approach 2:
The patent changes the geometric parameters of the inductance elements (spiral coil turns, meander line segments, conductor trace width and spacing) to control the value of parallel inductance L. By adjusting these planar geometric parameters, the desired inductance value is achieved without modifying the vertical thickness of the device structure.
2Quantity of substance
If conductor pieces are made larger to increase series capacitance C, then band gap bandwidth is widened, but device area increases
Solution Approach 1:
The patent adjusts the geometric parameters of conductor pieces (area, perimeter, shape) to control series capacitance C. By optimizing these parameters within a compact footprint, the desired capacitance value is achieved without proportionally increasing the device area, allowing bandwidth expansion in a space-efficient manner.
Solution Approach 2:
The patent employs a composite structure combining conductor pieces, dielectric materials with specific permittivity values, and planar inductance elements. This composite approach allows tuning of series capacitance C through material selection and geometric configuration, achieving the desired electrical characteristics without simply scaling up the conductor piece size.
3Quantity of substance
If high-permittivity dielectric materials are used to increase capacitance, then band gap bandwidth is widened, but manufacturing cost increases
Solution Approach 1:
The patent achieves the desired capacitance values by modifying geometric parameters (conductor piece area, spacing, thickness) rather than relying solely on high-permittivity materials. This approach uses standard, cost-effective dielectric materials while achieving the same electrical performance through optimized dimensions, thereby reducing material costs.
Solution Approach 2:
The patent substitutes expensive high-permittivity dielectric materials with cheaper, more readily available standard dielectric materials. By compensating for the lower permittivity through increased geometric dimensions or optimized configurations, the patent achieves comparable electrical performance at reduced material cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the miniaturization of electromagnetic band gap devices with enhanced band gap bandwidth, reducing manufacturing costs and avoiding the need for expensive high-permittivity materials, while maintaining effective electromagnetic wave suppression and reflection properties.
Implementation Method 1
The parallel inductances L are mostly formed by the conductor posts 7, and their value depends on the length of the conductor posts 7. The island electrodes 105 and the conductor plane 103 are electrically connected through the planar inductance elements 106.
Implementation Method 2
Important characteristics include the suppression of surface waves (surface current) and the in-phase reflection of electromagnetic waves.
Implementation Method 3
The series capacitances C are formed between adjoining conductor pieces, and their value depend on the distance between the adjoining conductor pieces and the size of the conductor pieces.
Data Source
AI summary
Conductor pieces 102 that are periodically arrayed, a conductor plane 103 that has openings 104 periodically arrayed so as to correspond to the conductor pieces 102, and a dielectric 108 that is arranged between the conductor pieces 102 and the conductor plane 103, are included. Island electrodes 105 and planar inductance elements 106 are arranged in the openings 104 of the conductor plane 103. The island electrodes 105 and the conductor pieces 102 are connected by conductor posts 107. The island electrodes 105 and the conductor plane 103 are connected through the planar inductance elements 106.