Planar Inductive Structure Thermal Bridge via Vertical Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization of planar inductive windings leads to significant temperature rise at the center of the spiral structure, causing deterioration and requiring increased conductive track width, which contradicts the goal of miniaturization.
Innovation Solution
A spiral structure with a conductive track in a second level connected by vias to a conductive plane at diametrically opposite positions, forming a thermal bridge to capture and remove heat, while maintaining a narrow width that minimizes impact on electric performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the width of the conductive track is increased to reduce temperature rise, then the thermal behavior improves, but the area occupied by the inductive structure increases, contradicting the miniaturization goal
Solution Approach 1:
The patent introduces a vertical dimension by adding a second conductive level with a heat transfer track that connects to the first level via vias. This three-dimensional configuration allows heat to be extracted from the center of the spiral structure vertically, rather than relying solely on horizontal heat dissipation through wider tracks, thus achieving thermal management without increasing the planar footprint.
Solution Approach 2:
The heat transfer track in the second conductive level acts as an intermediary thermal pathway. It connects to the center of the spiral structure through vias and provides an additional route for heat extraction, mediating the thermal management function without requiring the conductive tracks in the first level to be widened.
2Reliability
If the width of the conductive track is increased to improve thermal behavior, then the temperature rise is reduced, but the miniaturization objective is compromised
Solution Approach 1:
The solution moves the heat transfer function to a different spatial dimension by implementing it in a second conductive level above the spiral structure. This vertical separation allows the inductive element to maintain its compact planar dimensions while achieving improved thermal behavior through the elevated heat extraction pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal behavior by effectively removing heat from the center of the spiral structure without degrading electric performance, allowing for more compact and efficient inductive elements.
Implementation Method 1
at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding
Data Source
AI summary
A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.