Planar Inductor Cooling Package With Double-Sided Core Heat Dissipation
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Solution Overview
Problem
High temperatures generated by the cores of planar inductors in high power applications degrade the ferrite material, leading to inefficient and unreliable operation, necessitating an effective cooling solution for thermal management.
Innovation Solution
A cooling package comprising a cold plate and a heat-spreading bracket with high thermal conductivity, mechanically coupled to the cold plate, which absorbs and dissipates heat from both inductor cores while applying a clamping force to secure the upper core, providing double-sided cooling and enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If single-sided cooling through cold plate is used, then heat dissipation is provided, but temperature reduction is insufficient for both cores
Solution Approach 1:
The cooling structure is segmented into two independent cooling paths: one through the cold plate for the first core, and another through the heat-spreading bracket for the second core. This allows each core to be cooled independently through its dedicated heat dissipation path, effectively reducing temperatures without requiring a single complex integrated system.
Solution Approach 2:
The heat-spreading bracket acts as an intermediary component between the second inductor core and the cold plate. It transfers heat from the second core to the cold plate through thermal conduction, enabling indirect cooling of the second core while maintaining the simple cold plate structure.
2Loss of energy
If heat-spreading bracket is added for double-sided cooling, then heat dissipation from both cores is improved, but device complexity increases
Solution Approach 1:
The heat-spreading bracket serves multiple functions simultaneously: it acts as a heat dissipation path for the second core, provides mechanical clamping force to secure both cores, and maintains structural support for the inductor assembly. This multi-functionality improves heat dissipation efficiency without proportionally increasing device complexity.
Solution Approach 2:
The cooling function and mechanical clamping function are merged into a single integrated bracket structure. The heat-spreading bracket combines thermal conduction capabilities with mechanical fastening features, eliminating the need for separate cooling components and fasteners, thus improving heat dissipation while minimizing additional complexity.
3Strength
If clamping force is applied to secure upper core, then mechanical stability is improved, but heat transfer path may be compromised
Solution Approach 1:
The bracket is designed with differentiated local properties: regions contacting the cores have high thermal conductivity for efficient heat transfer, while clamping regions provide mechanical force. This local differentiation ensures that heat transfer paths remain open and efficient while maintaining secure mechanical attachment of the cores.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature of both inductor cores, ensuring efficient operation and extending the lifetime of the planar inductor assembly by continuous heat dissipation and secure mechanical clamping.
Implementation Method 1
a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket... applies a clamping force to a second inductor core... configured to apply a clamping force to a second inductor core
Implementation Method 2
the cold plate has a slotted recess for mounting a first inductor core along a first end thereof... heat generated by the planar inductor is dissipated to the cooled PCB substrate or the cold plate
Data Source
AI summary
Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.