Planar Inductor Devices With Embedded Ferrite Body
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Solution Overview
Problem
Traditional inductive devices, such as transformers and inductors, are often large and limited in topology and performance, especially in communication devices, due to the size and fragility of ferrites, which can be damaged during assembly and require significant space on circuit boards.
Innovation Solution
A multilayer inductor device is developed, featuring a planar substrate with a ferrite body and helically wrapped conductive coils, including upper and lower conductors and conductive vias, to create a compact and robust inductive component that minimizes the risk of ferrite damage during integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional ferrite inductors are used, then inductive function is achieved, but device size becomes large and ferrite becomes fragile
Solution Approach 1:
The patent transitions from traditional three-dimensional wire-wound inductors to a planar two-dimensional configuration where conductive traces are patterned on a substrate. This dimensional change allows the inductor to be flattened and integrated into circuit boards, reducing overall device volume while maintaining inductive functionality through carefully designed trace geometries that compensate for the reduced dimensionality.
Solution Approach 2:
The patent divides the continuous wire-wound structure into segmented conductive traces patterned on the substrate. These traces are broken into multiple segments that are connected through vias, creating a distributed inductive structure. This segmentation allows the inductor to be manufactured using standard PCB techniques and reduces the mechanical stress concentration that would otherwise make the ferrite core vulnerable to damage.
2Volume of moving object
If ferrite size is decreased to reduce inductor volume, then device compactness improves, but ferrite becomes damaged during assembly
Solution Approach 1:
The patent replaces the mechanical wire-winding process with a photolithographic patterning process. Instead of manually or mechanically wrapping wire around a ferrite core, conductive traces are deposited and patterned directly onto the substrate using standard semiconductor manufacturing techniques. This eliminates the mechanical stress and handling that would damage small ferrite components during assembly.
Solution Approach 2:
The patent creates a composite structure integrating conductive traces, dielectric layers, and magnetic materials into a unified planar inductor. The conductive traces are embedded within or on top of dielectric layers, which are in turn integrated with magnetic shielding or core materials. This composite approach distributes mechanical stress across multiple materials with different properties, preventing ferrite damage while maintaining compact dimensions.
3Ease of manufacture
If wire is hand or machine-wrapped around ferrites, then inductive coil is formed, but manufacturing complexity increases and space consumption grows
Solution Approach 1:
The patent replaces the mechanical wire-winding operation with a photolithographic patterning process. Conductive traces are formed by depositing conductive material and patterning it through photolithography, followed by etching to remove unwanted material. This eliminates the complex mechanical winding process entirely, allowing inductors to be manufactured using standard PCB fabrication techniques that are highly automated and space-efficient.
Solution Approach 2:
The patent transitions from three-dimensional wire-wound coils to two-dimensional planar traces on a circuit board. This dimensional reduction allows multiple inductors to be placed in parallel on the same board area, dramatically increasing the number of inductors that can be integrated into a given space while simplifying the manufacturing process to standard PCB operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of smaller, more reliable inductive devices that reduce the risk of ferrite damage and optimize space usage on communication device circuit boards, enhancing performance and reliability.
Implementation Method 1
Current flows through the wire and generates magnetic flux in the magnetic body
Implementation Method 2
the inductive devices can include one or more inductors, transformers, or chokes... wrapped around an iron or magnetic body
Data Source
AI summary
A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.