Planar Inductor Integration in Multilayer Package Substrates
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Solution Overview
Problem
The increasing demand for high-performance inductors in modern RF designs, such as filters and amplifiers, is hindered by the large footprint of coils, which restricts electrical characteristics and increases production costs, particularly in semiconductor devices.
Innovation Solution
A semiconductor device with a multilayer package substrate that integrates a planar inductor and capacitor, forming a passive filter within the substrate, allowing for a compact design that eliminates the need for a separate filter on the printed circuit board, thereby improving noise rejection and loop gain without increasing footprint or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional coils are used to implement inductors in RF designs, then the required inductance values can be achieved, but the footprint area increases and electrical characteristics are restricted
Solution Approach 1:
The patent transitions from traditional three-dimensional coil structures to two-dimensional planar inductor designs fabricated on PCB traces. This dimensional reduction allows inductors to be integrated directly into the circuit board layout without requiring additional space for vertical coil structures, thereby improving electrical characteristics while reducing footprint area
Solution Approach 2:
The patent combines multiple functions into integrated filter modules that incorporate both planar inductors and capacitors in single compact units. These modules merge power conversion, filtering, and noise rejection functions into unified structures that eliminate the need for separate discrete components, thus reducing overall footprint while maintaining required electrical performance
2Reliability
If extensive layout of inductors is used in power converters, then the required inductance values can be achieved, but the chip size increases and production costs rise
Solution Approach 1:
The patent integrates inductors, capacitors, and power conversion circuitry into unified modules that can be manufactured as single units. This merging of components eliminates the need for extensive manual assembly and reduces the number of discrete parts requiring procurement, inventory management, and assembly, thereby lowering production costs while maintaining required inductance performance
Solution Approach 2:
The patent designs universal filter modules that can be applied across multiple power converter applications and configurations. These multi-functional modules serve as both power conversion elements and noise filtering components, reducing the need for application-specific custom designs and enabling standardized manufacturing processes that lower production costs
3Object-affected harmful factors
If separate filters are added to PCB for noise rejection, then noise filtering performance improves, but the overall device complexity and component count increase
Solution Approach 1:
The patent integrates noise rejection filtering functions directly into the power converter modules by incorporating planar inductors and capacitors as built-in components. This merging of filtering functionality with power conversion eliminates the need for separate external filters on the PCB, reducing component count and device complexity while maintaining effective noise rejection performance
Solution Approach 2:
The patent enables power converter modules to provide their own noise filtering and electromagnetic interference rejection through integrated passive components. The modules are self-sufficient in terms of noise management, eliminating the need for additional dedicated filtering components and simplifying the overall system architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a planar inductor and capacitor within the multilayer package substrate enhances the performance of power converter modules by providing a two-section input filter, improving noise rejection and frequency performance while maintaining a compact and cost-effective design.
Implementation Method 1
a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to an input port of the die with a second via of the multilayer package substrate
Implementation Method 2
The multilayer package substrate also includes a passive filter with an input port and an output port, and a planar inductor
Data Source
AI summary
A semiconductor device includes a die having an input port and an output port. The semiconductor device also includes a multilayer package substrate with pads on a surface of the multilayer package substrate configured to be coupled to circuit components of a printed circuit board. The multilayer package substrate also includes a passive filter comprising an input port and an output port, and a planar inductor. The planar inductor is coupled to a given pad of the pads of the multilayer package substrate with a first via of the multilayer package substrate and to the input port of the die with a second via of the multilayer package substrate. The planar inductor extends parallel to the surface of the multilayer package substrate.