Planar Inductor with Vertical Terminals for 3D Mounting
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Solution Overview
Problem
Existing inductor components face challenges in maintaining characteristics when substrates are thinned, and they are not well-suited for three-dimensional mounting due to wire-wound structures and unnecessary wiring routing in surface-mount configurations.
Innovation Solution
The inductor component features a flat-plate main body with a magnetic layer and vertical wiring lines extending through the main body, allowing for flexible mounting from both sides and reducing unnecessary wiring, while an insulation layer enhances insulating properties and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a wire-wound inductor component is embedded in a substrate, then the inductor component can be mounted in a substrate, but it is difficult to maintain the characteristics of the inductor component when the substrate is thinned
Solution Approach 1:
The patent transitions from a wire-wound structure with coil diameter parallel to substrate thickness to a planar spiral winding structure where the coil lies in the substrate plane. This dimensional change allows the inductor to maintain its characteristics even when the substrate is thinned, as the magnetic field is generated in the plane rather than relying on vertical coil turns.
Solution Approach 2:
The patent extracts the essential inductance-generating function from the traditional wire-wound structure and implements it through a planar spiral pattern. By removing the vertical winding component and retaining only the planar spiral structure, the inductor achieves substrate thinning compatibility while maintaining functionality.
2Ease of operation
If the inductor wiring line is extended to the side-surface side for connection, then the inductor component can be connected to external terminals, but unnecessary wiring routing is produced in three-dimensional mounting
Solution Approach 1:
The patent changes the connection direction from side-surface (horizontal) to upper/lower surface (vertical) by extending terminal electrodes in the thickness direction. This dimensional change in terminal arrangement eliminates the need for detour wiring patterns, allowing direct vertical connections to substrate vias and reducing wiring complexity for three-dimensional mounting.
Solution Approach 2:
Instead of extending terminals horizontally to side surfaces as in conventional surface-mount inductors, the patent inverts the terminal extension direction to vertically upward/downward. This inversion optimizes the structure for three-dimensional mounting where vertical via connections are used, eliminating unnecessary horizontal wiring detours.
3Ease of manufacture
If the inductor component is designed for surface mounting with L-shaped terminals, then it can be easily mounted on substrate, but it is not suitable for three-dimensional mounting
Solution Approach 1:
The patent designs the inductor with terminal electrodes that can be connected to both upper and lower surfaces of the substrate, making it universally applicable to both surface-mount and three-dimensional mounting technologies. The planar spiral structure combined with vertically extendable terminals allows the same component to serve multiple mounting purposes.
Solution Approach 2:
By extending terminal electrodes in the thickness direction (vertical dimension) rather than only in the plane direction, the patent enables the inductor to accommodate three-dimensional mounting requirements while maintaining compatibility with conventional surface-mounting processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the degree of freedom in circuit design, supports three-dimensional mounting, and improves the reliability and characteristics of the inductor component by reducing warp and unnecessary wiring, while maintaining excellent DC superposition characteristics.
Implementation Method 1
a magnetic layer containing a resin and metal magnetic powder contained in the resin; an inductor wiring line disposed on a plane inside the main body
Data Source
AI summary
An inductor component includes a main body formed in a flat-plate shape and including a magnetic layer; an inductor wiring line disposed on a plane inside the main body; a first vertical wiring line that extends, from a pad portion which is an end portion of the inductor wiring line, in a first direction to pass through the inside of the main body, and is exposed on a first principal surface side of the main body; a second vertical wiring line that extends, from the pad portion of the inductor wiring line, in a second direction to pass through the inside of the main body, and is exposed on a second principal surface side of the main body; and an insulation layer of a non-magnetic body. The first vertical wiring line includes a via conductor and a columnar wiring line. The second vertical wiring line includes a columnar wiring line.