Planar Lead Frame with Inserted Top-Side Terminals
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Solution Overview
Problem
Three-dimensional lead frames require thicker routing planes than necessary, leading to unnecessary material thickness and high tooling costs due to the need for multiple stamping and forming dies.
Innovation Solution
A circuit assembly using a planar lead frame with coplanar sections and top-side terminals of varying thickness, where the terminals are inserted into holes in the lead frame to form electrical connections, optimizing material thickness for current carrying capacity and reducing the need for complex three-dimensional forming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If three-dimensional lead frames are used to form vertically oriented terminals by bending, then terminal structural strength is improved, but routing plane thickness increases unnecessarily and tooling costs increase
Solution Approach 1:
The invention divides the lead frame into separate functional components: a planar routing plane made of thin material and separate terminal structures made of thicker material. This segmentation allows each component to be optimized independently for its specific function, resolving the contradiction between terminal strength and routing plane thickness.
Solution Approach 2:
The invention applies different material thicknesses to different locations within the lead frame structure. The routing plane uses thin material sufficient for its electrical routing function, while terminals use thicker material for structural strength. This local differentiation eliminates unnecessary material usage while maintaining required performance.
2Adaptability or versatility
If three-dimensional lead frames require multiple stamping and forming dies, then terminal formation capability is improved, but tooling costs increase
Solution Approach 1:
The invention separates terminal formation from routing plane fabrication, allowing the routing plane to be produced by a single stamping process while terminals are added separately through insertion or attachment. This eliminates the need for multiple complex forming dies while maintaining terminal formation capability.
Solution Approach 2:
The invention prepares terminals separately and attaches them to the pre-formed routing plane, rather than forming three-dimensional terminals through complex sequential stamping operations. This preliminary preparation approach simplifies the main manufacturing process and reduces tooling requirements.
3Shape
If vertically oriented terminals are formed by bending, then terminal protrusion is achieved, but material utilization efficiency decreases
Solution Approach 1:
The invention uses thin material for the planar routing plane where minimal thickness is needed for electrical routing, and reserves thicker material only for terminal portions requiring structural strength and protrusion. This localized material allocation maximizes overall material utilization efficiency.
Solution Approach 2:
By separating the routing plane and terminal structures into distinct components with different material thicknesses, the invention eliminates waste of thick material in areas where thin material suffices, thereby improving material utilization efficiency while achieving required terminal protrusion.
Data Source
AI summary
A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane.