Planar Light Emitting Device Side-Access Substrate Fixing
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Solution Overview
Problem
Existing planar light emitting devices require complex disassembly to replace light source substrates, leading to reduced heat dissipation and reliability due to clearance between the substrate and the lower case, which affects the brightness and lifespan of point light sources.
Innovation Solution
A planar light emitting device design featuring a light guide plate with an inclined fixing member or screw that allows easy insertion and removal of the light source substrate from the side surface, enabling tight contact with a chassis for improved heat dissipation and simplified replacement, without the need to disassemble the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light source substrate is inserted from the side surface without screws or substrate holding members, then the replacement process is simplified and device complexity is reduced, but clearance is created between the substrate and lower case reducing heat dissipation
Solution Approach 1:
The device is divided into modular components: a removable light source substrate module and a fixed lower case with integrated heat dissipation structure. The substrate can be independently removed from the side surface without disassembling the entire device, while the lower case maintains continuous thermal contact with the substrate mounting area for effective heat dissipation.
Solution Approach 2:
A substrate fixing member with inclined portion acts as an intermediary mechanism. When pressed, it forces the light guide plate against the light source substrate to eliminate clearance, ensuring thermal contact. When removed, it allows easy substrate extraction from the side surface without requiring screw removal or device disassembly.
2Ease of operation
If clearance is provided for removing the light source substrate from the side surface, then ease of operation is improved, but heat dissipation is reduced causing increased temperature and reduced reliability
Solution Approach 1:
The substrate fixing member provides dynamic control of the contact between light guide plate and light source substrate. During normal operation, the fixing member is engaged to eliminate clearance and ensure thermal contact. During maintenance, the fixing member can be quickly released to allow substrate removal, providing dynamic adjustment between operational and maintenance states.
Solution Approach 2:
The inclined portion of the fixing member is designed to preliminarily force the light guide plate against the substrate when engaged, eliminating clearance before operation begins. This preliminary action ensures optimal thermal contact is established before the device starts operating, preventing temperature issues during normal use.
3Reliability
If screws or substrate holding members are used to fix the light source substrate, then heat dissipation is improved, but the number of steps for removing the substrate increases requiring device disassembly
Solution Approach 1:
The substrate fixing mechanism is extracted from the traditional screw-based system and repositioned to the side surface of the device. The fixing member can be independently accessed and operated from the side without requiring disassembly of the device housing or removal of multiple screws, separating the fixing function from the main device assembly steps.
Solution Approach 2:
Instead of fixing the substrate from the top or bottom surfaces using screws that require device disassembly, the fixing mechanism is inverted to operate from the side surface. The fixing member engages the substrate laterally, allowing maintenance personnel to access and operate the fixing mechanism from the side without disassembling the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, increases the reliability and brightness of the light source by allowing efficient transfer of heat from the substrate to the chassis, and simplifies the replacement process, reducing the number of steps required for maintenance.
Implementation Method 1
when the fixing member is pressed inside from outside the planar light emitting device, the light guide plate moves closer to the light source substrate, and the light source substrate is held and fixed between the side end surface of the light guide plate and the first chassis
Implementation Method 2
heat generated by light emission is not released to increase the temperature of the point light source and therearound to reduce the reliability (life) and brightness of the point light source
Data Source
AI summary
A planar light emitting device (PLED) includes: a light guide plate (LGP) having upper/lower surfaces; a light source substrate (LSS) mounted with a point light source parallel with a side end of the LGP; a first chassis covering a back of the LSS and a lower surface of the LGP in parallel; and a second chassis having an emission opening; a light source member in a side surface of the PLED; and a fixing member on the side of the PLED with an inclined portion. The inclined portion of the fixing member is formed so pressing the fixing member moves the LGP toward the LSS, which is fixed between the side end of the LGP and the first chassis. Removing the fixing member forms a gap between the LSS and the side end surface of the LGP or the first chassis, and the LSS can exit the LSS take-out portion.