Planar Light Source Wiring Layout for Isolated Through-Hole Connections

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Solution Overview

Problem

Existing planar light sources experience connection failures in the electrical connection structure between the wiring layer and the electrode of the light source due to the proximity and potential short-circuiting of the first and second through-holes.

Innovation Solution

A planar light source design with separated first and second through-holes, each connected to distinct wiring layers via separate wiring members, and a covering layer exposing these layers to prevent short-circuiting and ensure stable electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through-holes are provided in the insulating layer to electrically connect wiring layers and electrodes, then electrical connection is achieved, but connection failure and short-circuiting may occur due to proximity of through-holes

Engineering Contradiction:
Improveconnection reliabilityVSAvoidshort-circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The insulating layer is segmented into multiple distinct regions with through-holes separated by sufficient spacing. Each through-hole is independently formed and connected to specific wiring layers, creating isolated electrical connection paths that prevent short-circuiting between adjacent connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulating layer acts as an intermediary barrier between through-holes and wiring layers. Additionally, conductive members within through-holes are selectively connected to specific wiring layers through controlled formation processes, ensuring proper electrical isolation while maintaining necessary connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If through-holes are formed in the insulating layer for electrical connection, then electrical connectivity is established, but misalignment between through-holes and wiring layers may cause connection failure

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidthrough-hole and wiring layer alignment
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The insulating layer is formed first with predetermined through-hole positions and patterns before wiring layers are deposited. This preliminary formation establishes a stable reference structure that guides subsequent wiring layer deposition, ensuring automatic alignment between through-holes and wiring layers without requiring high-precision positioning during later manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The insulating layer exhibits different properties in different regions: regions with through-holes allow electrical connection, while regions between through-holes maintain electrical isolation. The through-holes themselves have conductive members with specific local conductivity, while surrounding insulating material maintains its insulating properties, creating localized functional zones that ensure proper connection and isolation.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3920247B1Planar light source
Publication Date: 2025.12.10 NICHIA CORP
  • EP3920247B1 patent drawingFigure 1
  • EP3920247B1 patent drawingFigure 2
  • EP3920247B1 patent drawingFigure 3

AI summary

A planar light source includes a wiring substrate including an insulating layer comprising a first through-hole, a second through-hole, a first wiring layer, and a second wiring layer; a light source including a first electrode and a second electrode, a light guide member; a first wiring member including a first portion filling the first through-hole and electrically connected to the first electrode and a second portion disposed below the insulating layer, continuous with the first portion, and in contact with the first wiring layer; and a second wiring member including a third portion filling the second through-hole and electrically connected to the second electrode and a fourth portion disposed below the insulating layer, continuous with the third portion, and in contact with the second wiring layer. The first and second wiring layers are arranged at opposite sides of the first and second through-holes in a top plan view.