Planar Lightwave Circuit Integration for WDM Systems
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Solution Overview
Problem
Wavelength division multiplexed (WDM) optical communication systems face challenges with high costs and performance due to the use of discrete components that introduce additional insertion loss.
Innovation Solution
Integration of optical interleaver and deinterleaver circuits, variable optical attenuators, and photodetectors on a substrate, allowing for compact and cost-effective multiplexing, demultiplexing, monitoring, and power regulation within a single chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If discrete components are used in WDM systems, then system functionality is achieved, but insertion loss increases and cost increases
Solution Approach 1:
The patent combines multiple discrete optical components (demultiplexer, interleaver, attenuators, photodetectors) into a single integrated planar lightwave circuit on one substrate. This merging eliminates the need for separate discrete components, reducing insertion loss at connection interfaces while achieving the same system functionality through unified integration.
2Quantity of substance
If discrete components are used in WDM systems, then system functionality is achieved, but system cost increases
Solution Approach 1:
The patent integrates multiple optical components into a single planar lightwave circuit, reducing the total quantity of discrete components from several separate devices to one unified device. This consolidation simplifies manufacturing processes, reduces assembly costs, and lowers the overall system cost while maintaining full functionality.
3Ease of operation
If multiple discrete components are used, then optical signal processing is achieved, but device size increases
Solution Approach 1:
The patent transitions from a three-dimensional arrangement of discrete components to a two-dimensional planar integration on a single substrate. This dimensional change allows multiple optical functions to be compactly arranged in a planar configuration, significantly reducing the overall device footprint while maintaining full optical signal processing capability.
Data Source
AI summary
Consistent with the present disclosure optical interleaver and deinterleaver circuits are integrated onto a substrate. The inputs to the interleaver and the outputs of the deinterleaver are each coupled to a corresponding variable optical attenuator (VOA) and optical tap, which are also provided on the substrate. The optical taps supply a portion of the output of each VOA to a corresponding photodetector. A control circuit, which is coupled to the photodetector, in turn, supplies a control signal to each VOA based on the output of the photodetector. Accordingly, optical multiplexing and demultiplexing components, as well as monitoring and power regulating components are provided on the same chip. Such a chip may be compact, relatively inexpensive, and has reduced power consumption compared to optical multiplexer and demultiplexer equipment including discrete components.